2024

Vol.30 No.4

Current Issue

Journal of the Microelectronics and Packaging Society 2023;30(4):

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  • A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding

    Yeonju Kim, Sang Woo Park, Min Seong Jung, Ji Hun Kim, and Jong Kyung Park

    Journal of the Microelectronics and Packaging Society 2023;30(4):8-16

  • Copper-Based Electrochemical CO2 Reduction and C2+ Products Generation: A Review

    Jiwon Heo1 , Chaewon Seong1 , Vishal Burungale2 , Pratik Mane1 , Moo Sung Lee1†, and Jun-Seok Ha1,2†

    Journal of the Microelectronics and Packaging Society 2023;30(4):17-31

  • Research Trends on Interface-type Resistive Switching Characteristics in Transition Metal Oxide

    Dong-eun Kim, Geonwoo Kim, Hyung Nam Kim, and Hyung-Ho Park

    Journal of the Microelectronics and Packaging Society 2023;30(4):32-43

  • A Study on the Development of a Program for Predicting Successful Welding of Electric Vehicle Batteries Using Laser Welding

    Cheol-Hwan Kim1*, Chan-Su Moon1*, Kwan-Su Lee1 , Jin-Su Kim2 , Ae-Ryeong Jo3 , and Bo-Sung Shin1†

    Journal of the Microelectronics and Packaging Society 2023;30(4):44-49

  • A Numerical Study on the Effect of Initial Shape on Inelastic Deformation of Solder Balls under Various Mechanical Loading Conditions

    Da-Hun Lee1 , Jae-Hyuk Lim1 , and Eun-Ho Lee1,2,3†

    Journal of the Microelectronics and Packaging Society 2023;30(4):50-60

  • Study on Sn-Ag-Fe Transient Liquid Phase Bonding for Application to Electric Vehicles Power Modules

    Byungwoo Kim1 , Hyeri Go1 , Gyeongyeong Cheon2 , Yong-Ho Ko2 , and Yoonchul Sohn1†

    Journal of the Microelectronics and Packaging Society 2023;30(4):61-68

  • MAGICal Synthesis: Memory-Efficient Approach for Generative Semiconductor Package Image Construction

    Yunbin Chang1 , Wonyong Choi2 , and Keejun Han1†

    Journal of the Microelectronics and Packaging Society 2023;30(4):69-78

  • A Study on the Phase Change of Cubic Bi1.5Zn1.0Nb1.5O7(c-BZN) and the Corresponding Change in Dielectric Properties According to the Addition of Li2CO3

    Yuseon Lee1 , Yunseok Kim1 , Seulwon Choi1 , Seongmin Han1 , and Kyoungho Lee1,2†

    Journal of the Microelectronics and Packaging Society 2023;30(4):79-85

  • A Study on the Control of Hygroscopicity and Hardness in Polymer Surfaces

    Jinil Kim1 , Young Nam Jung2 , Doa Kim3 , and Myung Yung Jeong1,2†

    Journal of the Microelectronics and Packaging Society 2023;30(4):86-90

  • Tin Oxide-modulated to Cu(OH)2 Nanowires for Efficient Electrochemical Reduction of CO2 to HCOOH and CO

    Chaewon Seong1 , Hyojung Bae2 , Sea Cho1 , Jiwon Heo1 , Eun Mi Han1†, and Jun-Seok Ha1†

    Journal of the Microelectronics and Packaging Society 2023;30(4):91-97

  • Fabrication of Porous Cu Layers on Cu Pillars through Formation of Brass Layers and Selective Zn Etching, and Cu-to-Cu Flip-chip Bonding

    Wan-Geun Lee1 , Kwang-Seong Choi2 , Yong-Sung Eom2 , and Jong-Hyun Lee1†

    Journal of the Microelectronics and Packaging Society 2023;30(4):98-104

  • Reliability of Cu Interconnect under Compressive Fatigue Deformation Varying Interfacial Adhesion Treatment

    Min Ju Kim, Jeong A Heo, Jun Hyeok Hyun, and So-Yeon Lee

    Journal of the Microelectronics and Packaging Society 2023;30(4):105-111

  • Error Correction

    Journal of the Microelectronics and Packaging Society 2023;30(4):112-112

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About KMEPS

The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.

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