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A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding
https://doi.org/10.6117/kmeps.2023.30.4.008
Journal of the Microelectronics and Packaging Society 2023;30(4):8-16
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Copper-Based Electrochemical CO2 Reduction and C2+ Products Generation: A Review
https://doi.org/10.6117/kmeps.2023.30.4.017
Journal of the Microelectronics and Packaging Society 2023;30(4):17-31
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Research Trends on Interface-type Resistive Switching Characteristics in Transition Metal Oxide
https://doi.org/10.6117/kmeps.2023.30.4.032
Journal of the Microelectronics and Packaging Society 2023;30(4):32-43
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A Study on the Development of a Program for Predicting Successful Welding of Electric Vehicle Batteries Using Laser Welding
https://doi.org/10.6117/kmeps.2023.30.4.044
Journal of the Microelectronics and Packaging Society 2023;30(4):44-49
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A Numerical Study on the Effect of Initial Shape on Inelastic Deformation of Solder Balls under Various Mechanical Loading Conditions
https://doi.org/10.6117/kmeps.2023.30.4.050
Journal of the Microelectronics and Packaging Society 2023;30(4):50-60
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Study on Sn-Ag-Fe Transient Liquid Phase Bonding for Application to Electric Vehicles Power Modules
https://doi.org/10.6117/kmeps.2023.30.4.061
Journal of the Microelectronics and Packaging Society 2023;30(4):61-68
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MAGICal Synthesis: Memory-Efficient Approach for Generative Semiconductor Package Image Construction
https://doi.org/10.6117/kmeps.2023.30.4.069
Journal of the Microelectronics and Packaging Society 2023;30(4):69-78
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A Study on the Phase Change of Cubic Bi1.5Zn1.0Nb1.5O7(c-BZN) and the Corresponding Change in Dielectric Properties According to the Addition of Li2CO3
https://doi.org/10.6117/kmeps.2023.30.4.079
Journal of the Microelectronics and Packaging Society 2023;30(4):79-85
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A Study on the Control of Hygroscopicity and Hardness in Polymer Surfaces
https://doi.org/10.6117/kmeps.2023.30.4.086
Journal of the Microelectronics and Packaging Society 2023;30(4):86-90
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Tin Oxide-modulated to Cu(OH)2 Nanowires for Efficient Electrochemical Reduction of CO2 to HCOOH and CO
https://doi.org/10.6117/kmeps.2023.30.4.091
Journal of the Microelectronics and Packaging Society 2023;30(4):91-97
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Fabrication of Porous Cu Layers on Cu Pillars through Formation of Brass Layers and Selective Zn Etching, and Cu-to-Cu Flip-chip Bonding
https://doi.org/10.6117/kmeps.2023.30.4.098
Journal of the Microelectronics and Packaging Society 2023;30(4):98-104
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Reliability of Cu Interconnect under Compressive Fatigue Deformation Varying Interfacial Adhesion Treatment
https://doi.org/10.6117/kmeps.2023.30.4.0105
Journal of the Microelectronics and Packaging Society 2023;30(4):105-111
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Error Correction
Journal of the Microelectronics and Packaging Society 2023;30(4):112-112
About KMEPS
The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.
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