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KCI Accredited Journals KCI 등재지
KCI Impact Factor 0.54
Journal of the Microelectronics and Packaging Society 2024;31(4):96-102. Published online: Jan, 22, 2025
DOI : doi.org/10.6117/kmeps.2024.31.4.096
Modern electronic devices have evolved to be mechanically flexible, capable of withstanding repetitive deformation. This advancement necessitates ensuring the long-term reliability of metal interconnects, which are essential components in flexible electronic devices. In this study, we analyzed the fatigue behavior of U-shaped structures under tensile conditions, focusing on modifications at the interface between copper (Cu) films and polyimide (PI) substrates. The U-folding fatigue method, which involves complete flattening and bending of the sample compared to U-sliding fatigue, better simulates the actual fatigue deformation occurring during flexible device usage. We compared two adhesion enhancement methods: oxygen plasma treatment and chromium (Cr) adhesion layer introduction. The interfacial adhesion was quantitatively evaluated through nanoscratch tests, while fatigue failure mechanisms were investigated using electrical resistance measurements and microstructural analysis. Our findings revealed that under fatigue strain of 1.0%, the Cr adhesion layer exhibited the highest adhesion strength and showed significant improvement in fatigue resistance. This research provides essential guidance for enhancing the long-term reliability of flexible electronic devices by suggesting effective methods to improve fatigue resistance under practical usage conditions.
Keywords Flexible substrate, Metal interconnect, Adhesion, Reliability, Deformation mechanism