Journal of the Microelectronics and Packaging Society

Recent advancements in microelectronic packaging, such as chiplet architectures and heterogeneous integration, require dissimilar materials and complex interconnects, which affect thermal and mechanical behaviors, impacting semiconductor performance and reliability. To address these challenges, a systematic approach to analyzing thermal-mechanical behavior is essential. This includes methods like continuum mechanics theory, material property evaluation, and structural pattern consideration. While progress has been made in material evaluation and structural patterns, discussions on applying continuum mechanics theory to packaging remain limited. This paper reviews continuum mechanics, focusing on its application for analyzing thermal-mechanical coupling in packaging. It covers thermal-mechanical equilibrium laws, dissipation, and the importance of combining mechanical and thermal aspects in thermodynamic laws, as well as formulating material constitutive equations. Finally, it compares traditional analytical methods, simulations, and AI-based evaluations for applying continuum mechanics in package analysis. As packaging becomes more complex, understanding continuum mechanics will be crucial in optimizing and ensuring package reliability.

Keywords Package, Thermal-mechanical behavior, Continuum mechanics, Numerical analysis, Artificial intelligence