Journal of the Microelectronics and Packaging Society

As semiconductor technology moves beyond Moore’s Law, heterogeneous integration packaging has become pivotal for high-performance, miniaturized devices. Advanced packaging techniques—including 2.5D/3D integration, fan-out wafer-level packaging, and Si-bridge interconnects—significantly improve functionality by integrating multiple dies in one package. However, warpage has emerged as a critical thermomechanical challenge, causing misalignment, yield loss, and interconnect failures. Accurate warpage measurement and characterization methods are vital for mitigating these issues. Both experimental and simulation approaches assess warpage under various structures and process conditions. Research reveals warpage behaviors in wafer-level, panel-level, and Si-bridge-based packages, emphasizing strategies like material selection, structural design, and process optimization to reduce deformation. Emerging solutions—such as machine learning, realtime monitoring, and adaptive process control—aim to further enhance warpage management, improving manufacturability and reliability. By consolidating recent findings and identifying remaining challenges, this review offers insights into future directions for effective warpage reduction in advanced semiconductor packaging.

Keywords Advanced packaging, Warpage, Si-bridge, 2.5D packaging, 3D integration, Warpage measurement