Journal of the Microelectronics and Packaging Society

As semiconductor chips continue to become smaller and more functional, there is an increasing demand for more robust packaging materials that can protect the chips and enhance their performance. In particular, the development of low-temperature solder materials with excellent thermal and mechanical reliability is of great importance. Therefore, in this study, a lead-free Sn-58Bi low-temperature solder material reinforced with Ti₃C₂T_x was developed using the solid-state mixing method of ball milling. The effects of Ti₃C₂T_x addition on the microstructure and mechanical strength of the Ti₃C₂T_x/Sn-58Bi nano metal composite were investigated. The experimental results showed that as the Ti₃C₂T_x content increased, the microstructure of the Sn-58Bi alloy became progressively finer, and the Vickers hardness increased. The nano metal composite with 0.13 wt.% Ti₃C₂T_x exhibited an approximately 31% increase in hardness. Meanwhile, the thickness of intermetallic compounds (IMCs) formed at the interface between the solder and the substrate made from Ti₃C₂T_x/Sn-58Bi nano metal composite powder gradually decreased as the Ti₃C₂T_x content increased. These results suggest that the Ti₃C₂T_x/Sn-58Bi nano metal composite developed in this study can be applied as an electronic packaging material with excellent thermal and mechanical reliability.

Keywords Ti₃C₂T_x, SnBi solder, Ball milling, Composite, Packaging