-
Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating
https://doi.org/10.6117/kmeps.2024.31.2.001
Journal of the Microelectronics and Packaging Society 2024;31(2):1-8
-
Effect of the Residual Impurity on the Prepreg Surface on the Wettability of Encapsulant for Chip on Board Package
https://doi.org/10.6117/kmeps.2024.31.2.009
Journal of the Microelectronics and Packaging Society 2024;31(2):9-15
-
Research on Process Technology of Molded Bridge Die on Substrate (MBoS) for Advanced Package
https://doi.org/10.6117/kmeps.2024.31.2.016
Journal of the Microelectronics and Packaging Society 2024;31(2):16-22
-
Time-Dependent Warpage Analysis for PCB Considering Viscoelastic Properties of Prepreg
https://doi.org/10.6117/kmeps.2024.31.2.023
Journal of the Microelectronics and Packaging Society 2024;31(2):23-27
-
Nondestructive Quantification of Corrosion in Cu Interconnects Using Smith Charts
https://doi.org/10.6117/kmeps.2024.31.2.028
Journal of the Microelectronics and Packaging Society 2024;31(2):28-35
-
Analysis of Plastic Deformation Behavior according to Crystal Orientation of Electrodeposited Cu Film Using Electron Backscatter Diffraction and Crystal Plasticity Finite Element Method
https://doi.org/10.6117/kmeps.2024.31.2.036
Journal of the Microelectronics and Packaging Society 2024;31(2):36-44
-
Study on Fault Diagnosis and Data Processing Techniques for Substrate Transfer Robots Using Vibration Sensor Data
https://doi.org/10.6117/kmeps.2024.31.2.045
Journal of the Microelectronics and Packaging Society 2024;31(2):45-53
-
An Investigation of the Current Squeezing Effect through Measurement and Calculation of the Approach Curve in Scanning Ion Conductivity Microscopy
https://doi.org/10.6117/kmeps.2024.31.2.054
Journal of the Microelectronics and Packaging Society 2024;31(2):54-62
-
Application and Performance Evaluation of Photodiode-Based Planck Thermometry (PDPT) in Laser-Based Packaging Processes
https://doi.org/10.6117/kmeps.2024.31.2.063
Journal of the Microelectronics and Packaging Society 2024;31(2):63-68
-
Magnetic Induction Soldering Process for Mounting Electronic Components on Low Heat Resistance Substrate Materials
https://doi.org/10.6117/kmeps.2024.31.2.069
Journal of the Microelectronics and Packaging Society 2024;31(2):69-77
-
Enhanced Electrochemical CO2 Reduction on Porous Au Electrodes with g-C3N4 Integration
https://doi.org/10.6117/kmeps.2024.31.2.078
Journal of the Microelectronics and Packaging Society 2024;31(2):78-84
-
MOCVD Growth and Characterization of Heteroepitaxial Beta-Ga2O3
https://doi.org/10.6117/kmeps.2024.31.2.085
Journal of the Microelectronics and Packaging Society 2024;31(2):85-91
About KMEPS
The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.
more