Journal of the Microelectronics and Packaging Society

The Polymer Bonding for Low-temperature Cu Hybrid Bonding

Ji Hun Kim and Jong Kyung Park^†

https://doi.org/10.6117/kmeps.2024.31.3.001

Journal of the Microelectronics and Packaging Society 2024;31(3):1-9

Advancements in Bonding Technologies for Flexible Display Driver IC(DDI) Packaging

Kyeong Tae Kim^1,2 and Yei Hwan Jung^1,†

https://doi.org/10.6117/kmeps.2024.31.3.010

Journal of the Microelectronics and Packaging Society 2024;31(3):10-17

Surface Nano-to-Micro Patterning for Rubber Magnet Composite via Extreme Pressure Imprint Lithography

Eun Bin Kang, Yu Na Kim, and Woon Ik Park^†

https://doi.org/10.6117/kmeps.2024.31.3.018

Journal of the Microelectronics and Packaging Society 2024;31(3):18-23

Cost-effective Machine Learning Method for Predicting Package Warpage during Mold Curing

Seong-Hwan Park¹ , Tae-Hyun Kim² , and Eun-Ho Lee^1,2,3†

https://doi.org/10.6117/kmeps.2024.31.3.024

Journal of the Microelectronics and Packaging Society 2024;31(3):24-37

Analysis of the Impact of Alignment Errors on Electrical Signal Transmission Efficiency in Interconnect and Bonding Structures

Seung Hwan O and Seul Ki Hong^†

https://doi.org/10.6117/kmeps.2024.31.3.038

Journal of the Microelectronics and Packaging Society 2024;31(3):38-41

Development and Evaluation of Trimodal Silver Paste for High-Frequency EMI Shielding Films with a Focus on Flexibility, Durability, and Shielding Characteristics

Hyun Jin Nam¹ , Seonwoo Kim¹ , Yubin Kim¹ , Se-Hoon Park¹ , Moses Gu² , and Su-Yong Nam^3,†

https://doi.org/10.6117/kmeps.2024.31.3.042

Journal of the Microelectronics and Packaging Society 2024;31(3):42-49

Time Reduction for Package Warpage Optimization based on Deep Neural Network and Bayesian Optimization

Jungeon Lee and Daeil Kwon^†

https://doi.org/10.6117/kmeps.2024.31.3.050

Journal of the Microelectronics and Packaging Society 2024;31(3):50-57

Study of the Operational Characteristics of Photodetectors Using Gallium Oxide

Hak Jun Ban, Seung Won Lee, and Seul Ki Hong^†

https://doi.org/10.6117/kmeps.2024.31.3.058

Journal of the Microelectronics and Packaging Society 2024;31(3):58-61

A Shape Inspection of Multiple Micro Solder Balls without Positioning Control

Jee Hong Kim^†

https://doi.org/10.6117/kmeps.2024.31.3.062

Journal of the Microelectronics and Packaging Society 2024;31(3):62-66

Evaluation Study of Performance for Solar Energy Blocking of Smart Windows based on Phase Retardation Film

Il-Gu Kim, Ho-Chang Yang, Young-Min Park, Yo-Han Suh, Seung Hyun Lee, and Young Kyu Hong^†

https://doi.org/10.6117/kmeps.2024.31.3.067

Journal of the Microelectronics and Packaging Society 2024;31(3):67-71

A Study on the Surface Patterns and Bonding Characteristics of Exposed Materials based on Wheel Grit Size during Package Grinding

Jin Park, Seojun Bae, Kwangil Kim, Jinho Lee, Sanggyu Jang, and Yong-Nam Koh^†

https://doi.org/10.6117/kmeps.2024.31.3.072

Journal of the Microelectronics and Packaging Society 2024;31(3):72-79

A Study about Decrease of Oxygen Permeability with Adding Glass Flakes and (3-Aminopropyl)triethoxysilane on Polyimide Films

Ha-Yoon Nah¹ , Taehee Kim¹ , Haryeong Choi¹ , Ji-Seoung Kim¹ , Won-Jun Lee¹ , Eunkyung Jeon² , Joon Hyuk Lee² , and Hyung-Ho Park^1,3†

https://doi.org/10.6117/kmeps.2024.31.3.080

Journal of the Microelectronics and Packaging Society 2024;31(3):80-86

Chip-to-chip Bonding with Polymeric Insulators

Ye Jin Oh, Seongwoo Jeon, Jin Su Shin, Kee-Youn Yoo^† , and Hyunsik Yoon^†

https://doi.org/10.6117/kmeps.2024.31.3.087

Journal of the Microelectronics and Packaging Society 2024;31(3):87-90

Driving Forces of Silver Nano-porous Sheet Die Bonding at 145 °C and 175 °C in the Air

YehRi Kim^1,2, Eunjin Jo^1,3, and Dongjin Kim^1,†

https://doi.org/10.6117/kmeps.2024.31.3.091

Journal of the Microelectronics and Packaging Society 2024;31(3):91-98

Analysis of Parasitic Inductance and Switching Losses through Lead Frame Modification and Snubber for Automotive SiC Power Modules

Jaejin Jeon¹ , Seokjin Shin² , Kyung Tae Min² , and Sang Won Yoon^1,†

https://doi.org/10.6117/kmeps.2024.31.3.099

Journal of the Microelectronics and Packaging Society 2024;31(3):99-104

Journal of the Microelectronics and Packaging Society 2024;31(3):105-105