Journal of the Microelectronics and Packaging Society

Ultrasensitive Crack-based Mechanosensor Inspired by Spider’s Sensory Organ

Suyoun Oh and Tae-il Kim^†

https://doi.org/10.6117/kmeps.2024.31.1.001

Journal of the Microelectronics and Packaging Society 2024;31(1):1-6

Research Trends in Thermal Interface Materials for Flexible and Stretchable Electronic Device

Young-Joo Park, Geon-Joo Jeong, and Kwang-Seok Kim^†

https://doi.org/10.6117/kmeps.2024.31.1.007

Journal of the Microelectronics and Packaging Society 2024;31(1):7-15

State of Health and State of Charge Estimation of Li-ion Battery for Construction Equipment based on Dual Extended Kalman Filter

Hong-Ryun Jung¹ , Jun Ho Kim¹ , Seung Woo Kim¹ , Jong Hoon Kim² , Eun Jin Kang² , and Jeong Woo Yun^1,†

https://doi.org/10.6117/kmeps.2024.31.1.016

Journal of the Microelectronics and Packaging Society 2024;31(1):16-22

Prediction of Maximum Bending Strain of a Metal Thin Film on a Flexible Substrate Using Finite Element Analysis

Jong Hyup Lee and Young-Cheon Kim^†

https://doi.org/10.6117/kmeps.2024.31.1.023

Journal of the Microelectronics and Packaging Society 2024;31(1):23-28

Flexible Planar Heater Comprising Ag Thin Film on Polyurethane Substrate

Seongyeol Lee¹ and Dooho Choi^2,†

https://doi.org/10.6117/kmeps.2024.31.1.029

Journal of the Microelectronics and Packaging Society 2024;31(1):29-34

Properties of Cu Pillar Bump Joints during Isothermal Aging

Eun-Su Jang¹ , Eun-Chae Noh¹ , So-Jeong Na² , and Jeong-Won Yoon^1,†

https://doi.org/10.6117/kmeps.2024.31.1.035

Journal of the Microelectronics and Packaging Society 2024;31(1):35-42

Electrical Properties of Two-dimensional Electron Gas at the Interface of LaAlO₃/SrTiO₃ by a Solution-based Process

Kyunghee Ryu¹ , Sanghyeok Ryou² , Hyeonji Cho¹ , Hyunsoo Ahn³ , Jong Hoon Jung³ , Hyungwoo Lee^2,4,†, and Jung-Woo Lee^1,†

https://doi.org/10.6117/kmeps.2024.31.1.043

Journal of the Microelectronics and Packaging Society 2024;31(1):43-48