Journal of the Microelectronics and Packaging Society

Review of Continuum Mechanical Theories for the Thermal-Mechanical Reliability Analysis of Packages

Jeong-Hyeon Park¹ , Hyunwoo Jung² , and Eun-Ho Lee^1,2,3,†

https://doi.org/10.6117/kmeps.2025.32.1.001

Journal of the Microelectronics and Packaging Society 2025;32(1):1-12

Trends in Ultra-High Density Hybrid Bonding Stack Equipment Technology for High Bandwidth Memory (HBM) Semiconductors

Seung-Hwan Joo^1,†, Jong-Su Lee² , Myung-Ho Lee³ , Il-Shin Song⁴ , Young-Soo Kim² , Kyoung-Rok Pyun¹ , Seung-Ouk Roh⁵ , Goo-Sang Jung⁶ , and Byoung-Lok Jang^1,†

https://doi.org/10.6117/kmeps.2025.32.1.013

Journal of the Microelectronics and Packaging Society 2025;32(1):13-28

Recent Advances in Electroless Plating for Seed Layer Deposition on Glass Interposers

Yubin Kim, Seonwoo Kim, Suin Chae, Se-Hoon Park, Soobin Park, and Hyun Jin Nam^†

https://doi.org/10.6117/kmeps.2025.32.1.029

Journal of the Microelectronics and Packaging Society 2025;32(1):29-46

Warpage in Advanced Packaging: Challenges, Measurement Techniques, and Mitigation Strategies for Heterogeneous Integration

Sun-Woo Lee^1,*, Min Sang Ju^1,2,*, and Taek-Soo Kim^1,2,†

https://doi.org/10.6117/kmeps.2025.32.1.047

Journal of the Microelectronics and Packaging Society 2025;32(1):47-60

Research Trends in AI-Assisted Technology for Reliability Life Prediction of Wafer-Level Package

Geon-Joo Jeong¹ , Dong Keun Lee^2,†, and Kwang-Seok Kim^1,†

https://doi.org/10.6117/kmeps.2025.32.1.061

Journal of the Microelectronics and Packaging Society 2025;32(1):61-74

A Study on the Aerosol 3D Printing 10 μm Micro Patterning

Hui-Tae Kim¹ , Ha-Neul Kim¹ , Ka-Hyun Lee² , Jong-Wook Shin³ , Kyoung-Rok Pyun¹ , Jong-Su Lee⁴ , Byoung-Lok Jang^1,†, and Seung-Hwan Joo^1,†

https://doi.org/10.6117/kmeps.2025.32.1.075

Journal of the Microelectronics and Packaging Society 2025;32(1):75-83

Effect of Iron Ions (Fe²⁺ and Fe³⁺) on the Decomposition of Organic Additives during Copper Electrodeposition

Kyungtae Kim^1,2, Min Ki Park³ , Yeunseok Ha³ , Chanyoung Jeong^2,†, and Seunghoe Choe^3,†

https://doi.org/10.6117/kmeps.2025.32.1.084

Journal of the Microelectronics and Packaging Society 2025;32(1):84-91

A Study of Improving the Mechanical Properties of Sn-Bi/Sn-Ag-Cu Hybrid Joints for Low-Temperature Soldering in Semiconductor Packages

Kwan-Soo Lim, Hyeon-Tae Kim, and Jeong-Won Yoon^†

https://doi.org/10.6117/kmeps.2025.32.1.092

Journal of the Microelectronics and Packaging Society 2025;32(1):92-99

Automatic Detailed Region of Interest Model for Real-Time Semiconductor Package Defect Detection

Seungtaek Lim¹ , Youngjin Park² , Wonyong Choi³ , and Keejun Han^1,†

https://doi.org/10.6117/kmeps.2025.32.1.100

Journal of the Microelectronics and Packaging Society 2025;32(1):100-113

A Study on the Fabrication of Ti-Based MXene and Sn-58Bi Nano Metal Composites and Their Soldering Properties for Electronic Packaging

Jae Jeong Lee¹ , Han Xue¹ , Hye Ri Go² , Yoon Chul Sohn² , and Yun Sung Woo^1,†

https://doi.org/10.6117/kmeps.2025.32.1.114

Journal of the Microelectronics and Packaging Society 2025;32(1):114-122

Journal of the Microelectronics and Packaging Society 2025;32(1):123-123