2025

Vol.32 No.1

Current Issue

Journal of the Microelectronics and Packaging Society 2025;32(1):

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  • Review of Continuum Mechanical Theories for the Thermal-Mechanical Reliability Analysis of Packages

    Jeong-Hyeon Park1 , Hyunwoo Jung2 , and Eun-Ho Lee1,2,3,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):1-12

  • Trends in Ultra-High Density Hybrid Bonding Stack Equipment Technology for High Bandwidth Memory (HBM) Semiconductors

    Seung-Hwan Joo1,†, Jong-Su Lee2 , Myung-Ho Lee3 , Il-Shin Song4 , Young-Soo Kim2 , Kyoung-Rok Pyun1 , Seung-Ouk Roh5 , Goo-Sang Jung6 , and Byoung-Lok Jang1,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):13-28

  • Recent Advances in Electroless Plating for Seed Layer Deposition on Glass Interposers

    Yubin Kim, Seonwoo Kim, Suin Chae, Se-Hoon Park, Soobin Park, and Hyun Jin Nam

    Journal of the Microelectronics and Packaging Society 2025;32(1):29-46

  • Warpage in Advanced Packaging: Challenges, Measurement Techniques, and Mitigation Strategies for Heterogeneous Integration

    Sun-Woo Lee1,*, Min Sang Ju1,2,*, and Taek-Soo Kim1,2,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):47-60

  • Research Trends in AI-Assisted Technology for Reliability Life Prediction of Wafer-Level Package

    Geon-Joo Jeong1 , Dong Keun Lee2,†, and Kwang-Seok Kim1,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):61-74

  • A Study on the Aerosol 3D Printing 10 μm Micro Patterning

    Hui-Tae Kim1 , Ha-Neul Kim1 , Ka-Hyun Lee2 , Jong-Wook Shin3 , Kyoung-Rok Pyun1 , Jong-Su Lee4 , Byoung-Lok Jang1,†, and Seung-Hwan Joo1,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):75-83

  • Effect of Iron Ions (Fe2+ and Fe3+) on the Decomposition of Organic Additives during Copper Electrodeposition

    Kyungtae Kim1,2, Min Ki Park3 , Yeunseok Ha3 , Chanyoung Jeong2,†, and Seunghoe Choe3,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):84-91

  • A Study of Improving the Mechanical Properties of Sn-Bi/Sn-Ag-Cu Hybrid Joints for Low-Temperature Soldering in Semiconductor Packages

    Kwan-Soo Lim, Hyeon-Tae Kim, and Jeong-Won Yoon

    Journal of the Microelectronics and Packaging Society 2025;32(1):92-99

  • Automatic Detailed Region of Interest Model for Real-Time Semiconductor Package Defect Detection

    Seungtaek Lim1 , Youngjin Park2 , Wonyong Choi3 , and Keejun Han1,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):100-113

  • A Study on the Fabrication of Ti-Based MXene and Sn-58Bi Nano Metal Composites and Their Soldering Properties for Electronic Packaging

    Jae Jeong Lee1 , Han Xue1 , Hye Ri Go2 , Yoon Chul Sohn2 , and Yun Sung Woo1,†

    Journal of the Microelectronics and Packaging Society 2025;32(1):114-122

  • Error Correction

    Journal of the Microelectronics and Packaging Society 2025;32(1):123-123

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About KMEPS

The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.

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