Journal of the Microelectronics and Packaging Society

A Review of Strategies for Improving Brittleness in Sn-58wt%Bi Solder for 3D Semiconductor Packaging Applications

Yeon Soo Park^1,*, Min Gyu Park^2,*, Byung Jun Kim³, and Jong-Woong Kim^2,3,†

https://doi.org/10.6117/kmeps.2024.31.4.001

Journal of the Microelectronics and Packaging Society 2025;31(4):1-17

Pressureless Sintering Technologies Using Ag and Cu-based Pastes

Yeonho Lee¹, Seonwoo Park¹, Minjae Kim¹, Sujin Koo¹, Jieun Lee¹, Changsu Park¹, and Jong-Hyun Lee^1,2,†

https://doi.org/10.6117/kmeps.2024.31.4.018

Journal of the Microelectronics and Packaging Society 2025;31(4):18-28

Next-Generation Semiconductor Packaging: Status of Co-Packaged Optics based on Silicon Photonics

JinTaewon, JoKyungjin, YoonSeokhyeon, JungHeeyun, ShinSeokyoung, JeongHyunji, KimKangseok, KimYounghyun^†

https://doi.org/10.6117/kmeps.2024.31.4.029

Journal of the Microelectronics and Packaging Society 2025;31(4):29-36

Recent Research Trends in TGV and Cu-Filling for AI Semiconductor Packaging

SeonShin Hui^*, CheonSeong Gyeong^*, JungJae Pil^†

https://doi.org/10.6117/kmeps.2024.31.4.037

Journal of the Microelectronics and Packaging Society 2025;31(4):37-46

Control of Laser-induced Periodic Surface Structures on the Sidewalls of Through Silicon Via Using Femtosecond Laser Burst Mode

KimTaesik^1,2, ParkJiyong^1,3,†

https://doi.org/10.6117/kmeps.2024.31.4.047

Journal of the Microelectronics and Packaging Society 2025;31(4):47-56

Design of a Vision Inspection System Based on Object Recognition Algorithm for Automated Defect Detection of Semiconductor Socket Micro Pins

ParkYoon-Ah¹, JungTae-Yeong¹, YooYoung-Jun¹, ChoHae-Guk², KimBo-Hyun², JiHyung-Yong^1,†, LeeHak-Jun^1,†

https://doi.org/10.6117/kmeps.2024.31.4.057

Journal of the Microelectronics and Packaging Society 2025;31(4):57-63

Finite Element Analysis of Wafer Level Warpage with Respect to the Materials of Through-via Layer during RDL Process in 2.xD Package

YangSeungchul¹, ImSeongwoo¹, KimJihoon¹, ShinChanseop¹, JangSanggyu¹, HaSangyul², JangJin-Wook^1,†

https://https://doi.org/10.6117/kmeps.2024.31.4.064

Journal of the Microelectronics and Packaging Society 2025;31(4):64-70

Preprocessing Method for Background Removal in 2D X-ray Images of Semiconductor Chips

OhChanyoung¹, ChoSeungryong¹, LeeTaewon^2,†

https://doi.org/10.6117/kmeps.2024.31.4.071

Journal of the Microelectronics and Packaging Society 2025;31(4):71-75

Comparison of Through Glass Via Machining Geometry and Mechanical Properties Using Single Mode and Burst Mode of Femtosecond Laser

LeeJaebeom^1,2, ParkJiyong^1,3,†

https://doi.org/10.6117/kmeps.2024.31.4.076

Journal of the Microelectronics and Packaging Society 2025;31(4):76-82

Electrochemical Evaluation of Anode Type on Fe-Ni Electroplating

KangNa Young, LeeJae Ho^†

https://doi.org/10.6117/kmeps.2024.31.4.083

Journal of the Microelectronics and Packaging Society 2025;31(4):83-88

Effect on Temperature Uniformity by Factor for the Design of Heater Pattern of Electrostatic Chuck

KimSang-Hoon^1,*, ParkSang-Hyeon^1,*, ShinHee-Jun¹, ParkJeong-Woo¹, YoonJungwoo¹, SeoKyoung-Jun¹, ImDong Hyeok², LeeYong-Seok^1,†

https://https://doi.org/10.6117/kmeps.2024.31.4.089

Journal of the Microelectronics and Packaging Society 2025;31(4):89-95

Reliability of Fatigue Deformation for Flexible Cu Interconnect Varying Interfacial Adhesion

HeoJeong A, HyunJun Hyeok, KimChae Young, JeonShin Hye, LeeSo-Yeon^†

https://doi.org/10.6117/kmeps.2024.31.4.096

Journal of the Microelectronics and Packaging Society 2025;31(4):96-102

Nanohardness Measurement of Cu Thinfilm on Polyimide Substrates with Area Function Calibration

HamJu-Bin, KimJi-Hyeon, NamSeo-Woo, SeoHee-Chang, NohWooram, KimYoung-Cheon^†

https://doi.org/10.6117/kmeps.2024.31.4.103

Journal of the Microelectronics and Packaging Society 2025;31(4):103-108