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Review of Continuum Mechanical Theories for the Thermal-Mechanical Reliability Analysis of Packages
https://doi.org/10.6117/kmeps.2025.32.1.001
Journal of the Microelectronics and Packaging Society 2025;32(1):1-12
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Trends in Ultra-High Density Hybrid Bonding Stack Equipment Technology for High Bandwidth Memory (HBM) Semiconductors
https://doi.org/10.6117/kmeps.2025.32.1.013
Journal of the Microelectronics and Packaging Society 2025;32(1):13-28
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Recent Advances in Electroless Plating for Seed Layer Deposition on Glass Interposers
https://doi.org/10.6117/kmeps.2025.32.1.029
Journal of the Microelectronics and Packaging Society 2025;32(1):29-46
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Warpage in Advanced Packaging: Challenges, Measurement Techniques, and Mitigation Strategies for Heterogeneous Integration
https://doi.org/10.6117/kmeps.2025.32.1.047
Journal of the Microelectronics and Packaging Society 2025;32(1):47-60
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Research Trends in AI-Assisted Technology for Reliability Life Prediction of Wafer-Level Package
https://doi.org/10.6117/kmeps.2025.32.1.061
Journal of the Microelectronics and Packaging Society 2025;32(1):61-74
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A Study on the Aerosol 3D Printing 10 μm Micro Patterning
https://doi.org/10.6117/kmeps.2025.32.1.075
Journal of the Microelectronics and Packaging Society 2025;32(1):75-83
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Effect of Iron Ions (Fe2+ and Fe3+) on the Decomposition of Organic Additives during Copper Electrodeposition
https://doi.org/10.6117/kmeps.2025.32.1.084
Journal of the Microelectronics and Packaging Society 2025;32(1):84-91
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A Study of Improving the Mechanical Properties of Sn-Bi/Sn-Ag-Cu Hybrid Joints for Low-Temperature Soldering in Semiconductor Packages
https://doi.org/10.6117/kmeps.2025.32.1.092
Journal of the Microelectronics and Packaging Society 2025;32(1):92-99
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Automatic Detailed Region of Interest Model for Real-Time Semiconductor Package Defect Detection
https://doi.org/10.6117/kmeps.2025.32.1.100
Journal of the Microelectronics and Packaging Society 2025;32(1):100-113
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A Study on the Fabrication of Ti-Based MXene and Sn-58Bi Nano Metal Composites and Their Soldering Properties for Electronic Packaging
https://doi.org/10.6117/kmeps.2025.32.1.114
Journal of the Microelectronics and Packaging Society 2025;32(1):114-122
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Error Correction
Journal of the Microelectronics and Packaging Society 2025;32(1):123-123
About KMEPS
The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.
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