Journal of the Microelectronics and Packaging Society

Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al₂O₃ Nano Coating

Soojae Park^1,†, Eunmin Cho¹ , Myoungsik Baek¹ , Eulgi Min² , and Kyujung Choi²

https://doi.org/10.6117/kmeps.2024.31.2.001

Journal of the Microelectronics and Packaging Society 2024;31(2):1-8

Effect of the Residual Impurity on the Prepreg Surface on the Wettability of Encapsulant for Chip on Board Package

Gahui Kim¹ , Doheon Kim² , Kirak Son³ , and Young-Bae Park^1,†

https://doi.org/10.6117/kmeps.2024.31.2.009

Journal of the Microelectronics and Packaging Society 2024;31(2):9-15

Research on Process Technology of Molded Bridge Die on Substrate (MBoS) for Advanced Package

Jaeyoung Jeon, Donggyu Kim, Wonseok Choi, Yonggyu Jang, Sanggyu Jang, and Yong-Nam Koh^†

https://doi.org/10.6117/kmeps.2024.31.2.016

Journal of the Microelectronics and Packaging Society 2024;31(2):16-22

Time-Dependent Warpage Analysis for PCB Considering Viscoelastic Properties of Prepreg

Chanhee Yang¹ , Chang-Yeon Gu¹ , Min Sang Ju¹ , Junmo Kim¹ , Dong Min Jang² , Jae Seok Jang² , Jin Woo Jang² , Jung Kyu Kim² , and Taek-Soo Kim^1,†

https://doi.org/10.6117/kmeps.2024.31.2.023

Journal of the Microelectronics and Packaging Society 2024;31(2):23-27

Nondestructive Quantification of Corrosion in Cu Interconnects Using Smith Charts

Minkyu Kang* , Namgyeong Kim* , Hyunwoo Nam, and Tae Yeob Kang^†

https://doi.org/10.6117/kmeps.2024.31.2.028

Journal of the Microelectronics and Packaging Society 2024;31(2):28-35

Analysis of Plastic Deformation Behavior according to Crystal Orientation of Electrodeposited Cu Film Using Electron Backscatter Diffraction and Crystal Plasticity Finite Element Method

Hyun Park, Han-Kyun Shin, Jung-Han Kim, and Hyo-Jong Lee^†

https://doi.org/10.6117/kmeps.2024.31.2.036

Journal of the Microelectronics and Packaging Society 2024;31(2):36-44

Study on Fault Diagnosis and Data Processing Techniques for Substrate Transfer Robots Using Vibration Sensor Data

MD Saiful Islam¹ , Mi-Jin Kim¹ , Kyo-Mun Ku¹ , Hyo-Young Kim^2,†, and Kihyun Kim^2,†

https://doi.org/10.6117/kmeps.2024.31.2.045

Journal of the Microelectronics and Packaging Society 2024;31(2):45-53

An Investigation of the Current Squeezing Effect through Measurement and Calculation of the Approach Curve in Scanning Ion Conductivity Microscopy

Young-Seo Kim, Young-Jun Cho, Han-Kyun Shin, Hyun Park, Jung Han Kim, and Hyo-Jong Lee^†

https://doi.org/10.6117/kmeps.2024.31.2.054

Journal of the Microelectronics and Packaging Society 2024;31(2):54-62

Application and Performance Evaluation of Photodiode-Based Planck Thermometry (PDPT) in Laser-Based Packaging Processes

Chanwoong Wi¹ , Junwon Lee¹ , Jaehyung Woo¹ , Hakyung Jeong² , Jihoon Jeong³ , and Seunghwoi Han^1,†

https://doi.org/10.6117/kmeps.2024.31.2.063

Journal of the Microelectronics and Packaging Society 2024;31(2):63-68

Magnetic Induction Soldering Process for Mounting Electronic Components on Low Heat Resistance Substrate Materials

Youngdo Kim^1,2†, Jungsik Choi² , Min-Su Kim³ , Dongjin Kim³ , Yong-Ho Ko³ , and Myung-Jin Chung¹

https://doi.org/10.6117/kmeps.2024.31.2.069

Journal of the Microelectronics and Packaging Society 2024;31(2):69-77

Enhanced Electrochemical CO₂ Reduction on Porous Au Electrodes with g-C₃N₄ Integration

Jiwon Heo, Chaewon Seong, and Jun-Seok Ha^†

https://doi.org/10.6117/kmeps.2024.31.2.078

Journal of the Microelectronics and Packaging Society 2024;31(2):78-84

MOCVD Growth and Characterization of Heteroepitaxial Beta-Ga₂O₃

Jeong Soo Chung¹ , An-Na Cha³ , Gieop Lee¹ , Sea Cho¹ , Young-Boo Moon⁴ , Myungshik Gim⁴ , Moo Sung Lee^1,†, and Jun-Seok Ha^1,2,†

https://doi.org/10.6117/kmeps.2024.31.2.085

Journal of the Microelectronics and Packaging Society 2024;31(2):85-91