2025

Vol.31 No.4

Current Issue

Journal of the Microelectronics and Packaging Society 2024;31(4):

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  • A Review of Strategies for Improving Brittleness in Sn-58wt%Bi Solder for 3D Semiconductor Packaging Applications

    Yeon Soo Park1,*, Min Gyu Park2,*, Byung Jun Kim3, and Jong-Woong Kim2,3,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):1-17

  • Pressureless Sintering Technologies Using Ag and Cu-based Pastes

    Yeonho Lee1, Seonwoo Park1, Minjae Kim1, Sujin Koo1, Jieun Lee1, Changsu Park1, and Jong-Hyun Lee1,2,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):18-28

  • Next-Generation Semiconductor Packaging: Status of Co-Packaged Optics based on Silicon Photonics

    JinTaewon, JoKyungjin, YoonSeokhyeon, JungHeeyun, ShinSeokyoung, JeongHyunji, KimKangseok, KimYounghyun

    Journal of the Microelectronics and Packaging Society 2024;31(4):29-36

  • Recent Research Trends in TGV and Cu-Filling for AI Semiconductor Packaging

    SeonShin Hui*, CheonSeong Gyeong*, JungJae Pil

    Journal of the Microelectronics and Packaging Society 2024;31(4):37-46

  • Control of Laser-induced Periodic Surface Structures on the Sidewalls of Through Silicon Via Using Femtosecond Laser Burst Mode

    KimTaesik1,2, ParkJiyong1,3,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):47-56

  • Design of a Vision Inspection System Based on Object Recognition Algorithm for Automated Defect Detection of Semiconductor Socket Micro Pins

    ParkYoon-Ah1, JungTae-Yeong1, YooYoung-Jun1, ChoHae-Guk2, KimBo-Hyun2, JiHyung-Yong1,†, LeeHak-Jun1,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):57-63

  • Finite Element Analysis of Wafer Level Warpage with Respect to the Materials of Through-via Layer during RDL Process in 2.xD Package

    YangSeungchul1, ImSeongwoo1, KimJihoon1, ShinChanseop1, JangSanggyu1, HaSangyul2, JangJin-Wook1,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):64-70

  • Preprocessing Method for Background Removal in 2D X-ray Images of Semiconductor Chips

    OhChanyoung1, ChoSeungryong1, LeeTaewon2,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):71-75

  • Comparison of Through Glass Via Machining Geometry and Mechanical Properties Using Single Mode and Burst Mode of Femtosecond Laser

    LeeJaebeom1,2, ParkJiyong1,3,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):76-82

  • Electrochemical Evaluation of Anode Type on Fe-Ni Electroplating

    KangNa Young, LeeJae Ho

    Journal of the Microelectronics and Packaging Society 2024;31(4):83-88

  • Effect on Temperature Uniformity by Factor for the Design of Heater Pattern of Electrostatic Chuck

    KimSang-Hoon1,*, ParkSang-Hyeon1,*, ShinHee-Jun1, ParkJeong-Woo1, YoonJungwoo1, SeoKyoung-Jun1, ImDong Hyeok2, LeeYong-Seok1,†

    Journal of the Microelectronics and Packaging Society 2024;31(4):89-95

  • Reliability of Fatigue Deformation for Flexible Cu Interconnect Varying Interfacial Adhesion

    HeoJeong A, HyunJun Hyeok, KimChae Young, JeonShin Hye, LeeSo-Yeon

    Journal of the Microelectronics and Packaging Society 2024;31(4):96-102

  • Nanohardness Measurement of Cu Thinfilm on Polyimide Substrates with Area Function Calibration

    HamJu-Bin, KimJi-Hyeon, NamSeo-Woo, SeoHee-Chang, NohWooram, KimYoung-Cheon

    Journal of the Microelectronics and Packaging Society 2024;31(4):103-108

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About KMEPS

The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.

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