2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):36-44. Published online: Jul, 25, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.2.036

Analysis of Plastic Deformation Behavior according to Crystal Orientation of Electrodeposited Cu Film Using Electron Backscatter Diffraction and Crystal Plasticity Finite Element Method

  • Hyun Park, Han-Kyun Shin, Jung-Han Kim, and Hyo-Jong Lee†
    Department of Materials Science and Engineering, Dong-A University, Busan 49315, Republic of Korea
Corresponding author E-mail: hyojong@dau.ac.kr
Abstract

Copper electrodeposition technology is essential for producing copper films and interconnects in the microelectronics industries including semiconductor packaging, semiconductors and secondary battery, and there are extensive efforts to control the microstructure of these films and interconnects. In this study, we investigated the influence of crystallographic orientation on the local plastic deformation of copper films for secondary batteries deformed by uniaxial tensile load. Crystallographic orientation maps of two electrodeposited copper films with different textures were measured using an electron backscatter diffraction (EBSD) system and then used as initial conditions for crystal plasticity finite element analysis to predict the local plastic deformation behavior within the films during uniaxial tension deformation. Through these processes, the changes of the local plastic deformation behavior and texture of the films were traced according to the tensile strain, and the crystal orientations leading to the inhomogeneous plastic deformation were identified.

Keywords Electrodeposited copper film, Crystallographic orientation, Plastic deformation, Electron backscatter diffraction (EBSD), Crystal plasticity finite element method

REFERENCES
  • P. Zhu, D. Gastol, J. Marshall, R. Sommerville, V. Goodship, and E. Kendrick, “A review of current collectors for lithiumion batteries”, J. Power Sources, 485, 229321 (2021).
  • H. Park, S.-J. Kim, Y.-j Song, H.-K. Shin, J.-B. Jeon, S.-D. Kim, J.-H. Kim, and H.-J. Lee, “Microstructure-controlled Electrodeposition of Mechanically Reliable Double-layered Thin Foils for Secondary Batteries”, Met. Mater. Int., 30, 1430-1439 (2024).
  • S.-J. Kim, H.-K. Shin, H. Park, and H.-J. Lee, “A Study on The Effect of Current Density on Copper Plating for PCB through Electrochemical Experiments and Calculations”, J. Microelectron. Packag. Soc., 29(1), 49-54 (2022).
  • F. Liu, A. Kubo, C. Nair, T. Ando, R. Furuya, S. Dwarakanath, V. Sundaram, and R. R. Tummala, “Next Generation Panel-Scale RDL with Ultra Small Photo Vias and Ultra-fine Embedded Trenches for Low Cost 2.5D Interposers and High Density Fan-Out WLPs”, IEEE 66th Electronic Components and Technology Conference (ECTC), 1515-1521 (2016).
  • C. H. Yu, L. J. Yen, C. Y. Hsieh, J. S. Hsieh, V. C. Y. Chang, C. H. Hsieh, C. S. Liu, C. T. Wang, K.-C. Yee, and D. C. H. Yu, “High Performance, High Density RDL for Advanced Packaging”, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 587-593 (2018).
  • K. Son, G. Kim, and Y.-B. Park, “Effects of Dielectric Curing Temperature and T/H Treatment on the Interfacial Adhesion Energies of Ti/PBO for Cu RDL Applications of FOWLP”, J. Microelectron. Packag. Soc., 30(2), 52-59 (2023).
  • S.-H. Kim, H.-J. Lee, D. Josell, and T. P. Moffat, “Bottomup Cu filling of annular through silicon vias: Microstructure and texture”, Electrochimica Acta, 335, 135612 (2020).
  • E.-S. Jang, E.-C. Noh, S.-J. Na, and J.-W. Yoon, “Properties of Cu Pillar Bump Joints during Isothermal Aging”, J. Microelectron. Packag. Soc., 31(1), 35-42 (2024).
  • Y. Kim, S. W. Park, M. S. Jung, J. H. Kim, and J. K. Park, “A Review on the Bonding Characteristics of SiCN for Lowtemperature Cu Hybrid Bonding”, J. Microelectron. Packag. Soc., 30(4), 8-16 (2023).
  • R. Rosenberg, D. C. Edelstein, C.-K. Hu, and K. P. Rodbell, “Copper Metallization for High Performance Silicon Technology”, Annu. Rev. Mater. Sci., 30, 229-262 (2000).
  • E. T. Ogawa, J. McPherson, J. A. Rosal, K. J. Dickerson, T.-C. Chiu, L. Y. Tsung, M. K. Jain, T. Bonifield, J. C. Ondrusek, and W. R. McKee, “Stress-Induced Voiding Under Vias Connected To Wide Ch Metal Leads”, 40th Annual IEEE International Reliability Physics Symposium, 312-321 (2002).
  • C. S. Hau-Riege, “An introduction to Cu electromigration”, Microelectronics Reliability, 44(2), 195-205 (2004).
  • J.-M. Paik, H. Park, Y.-C. Joo, and K.-C. Park, “Effect of dielectric materials on stress-induced damage modes in damascene Cu lines”, J. Appl. Phys., 97(10), 104513 (2005).
  • H. Park, M. Kraatz, J. Im, B. Kastenmeier, and P. S. Ho, “Simulation of Electrical and Mechanical Properties of AirBridge Cu Interconnects”, 2006 IEEE International Reliability Physics Symposium Proceedings, 677-678 (2006).
  • H. Park, S.-J. Hwang, and Y.-C. Joo, “Stress-induced surface damage and grain boundary characteristics of sputtered and electroplated copper thin films”, Acta Materialia, 52(8), 2435-2440 (2004).
  • H. Park, S.-H. Kim, W.-J. Lee, J.-W. Ha, S.-J. Kim, and H.-J. Lee, “Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in HighPurity Copper Wires”, Met. Mater. Int., 27(7), 2220-2229 (2021).
  • H.-K. Shin, S.-H. Kim, H. Park, and H.-J. Lee, “Multilayer Laminated Copper Electrodeposits and Their Mechanical Properties”, J. Electrochem. Soc., 169(10), 102502 (2022).
  • H. Park, W.-J. Lee, J.-H. Son, H.-K. Shin, S.-K. Hong, and H.-J. Lee, “Effects of Pilger Rolling and Heat Treatment on Microstructure and Corrosion Resistance of Ag-Electroplated 304 Stainless Steel Tubes”, Met. Mater. Int., 28(8), 1881-1889 (2022).
  • F. J. Humphreys and M. Hatherly, “Recrystallization and Related Annealing Phenomena”, 1-220, Pergamon Press, Elsevier Science Ltd., Oxford, UK (1995).
  • C. V. Thompson, “Structure Evolution during Processing of Polycrystalline films”, Annu. Rev. Mater. Sci., 30, 159-190 (2000).
  • D. N. Lee, “Texture and Related Phenomena”, 2nd edn., 280-484, The Korean Institute of Metals and Materials, Korea (2014).
  • S. R. Kalindindi, “Polycrystal Plasticity: Constitutive Modeling and deformation processing”, in Ph.D. Thesis, 5-185, Massachusetts Institute of Technology, Cambridge, UK (1992).
  • F. Roters, P. Eisenlohr, T. R. Bieler, and D. Raabe, “Crystal Plasticity Finite Element Methods in Materials Science and Engineering”, 13-91, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany (2010).
  • H. Park and D. N. Lee, “Effects of Shear Strain and Drawing Pass on the Texture Development in Copper Wire”, Mater. Sci. Forum, 408-412, 637-642 (2002).