2024

Vol.31 No.2

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):36-44. Published online: Jul, 25, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.2.036

Analysis of Plastic Deformation Behavior according to Crystal Orientation of Electrodeposited Cu Film Using Electron Backscatter Diffraction and Crystal Plasticity Finite Element Method

  • Hyun Park, Han-Kyun Shin, Jung-Han Kim, and Hyo-Jong Lee†
    Department of Materials Science and Engineering, Dong-A University, Busan 49315, Republic of Korea
Corresponding author E-mail: hyojong@dau.ac.kr
Abstract

Copper electrodeposition technology is essential for producing copper films and interconnects in the microelectronics industries including semiconductor packaging, semiconductors and secondary battery, and there are extensive efforts to control the microstructure of these films and interconnects. In this study, we investigated the influence of crystallographic orientation on the local plastic deformation of copper films for secondary batteries deformed by uniaxial tensile load. Crystallographic orientation maps of two electrodeposited copper films with different textures were measured using an electron backscatter diffraction (EBSD) system and then used as initial conditions for crystal plasticity finite element analysis to predict the local plastic deformation behavior within the films during uniaxial tension deformation. Through these processes, the changes of the local plastic deformation behavior and texture of the films were traced according to the tensile strain, and the crystal orientations leading to the inhomogeneous plastic deformation were identified.

Keywords Electrodeposited copper film, Crystallographic orientation, Plastic deformation, Electron backscatter diffraction (EBSD), Crystal plasticity finite element method

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