2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):16-22. Published online: Jul, 25, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.2.016

Research on Process Technology of Molded Bridge Die on Substrate (MBoS) for Advanced Package

  • Jaeyoung Jeon, Donggyu Kim, Wonseok Choi, Yonggyu Jang, Sanggyu Jang, and Yong-Nam Koh†
    HANA Micron Ins., 77, Yeonamyulgeum-ro, Eumbong-myeon, Asan-si, Chungcheongnam-do, Republic of Korea
Corresponding author E-mail: yongnamkoh@hanamicron.co.kr
Abstract

With advances of artificial intelligence (AI) technology, the demand is increasing for high-end semiconductors in various places such as data centers. In order to improve the performance of semiconductors, reducing the pitch of patterns and increasing density of I/Os are required. For this issue, 2.5dimension(D) packaging is gaining attention as a promising solution. The core technologies used in 2.5D packaging include microbump, interposer, and bridge die. These technologies enable the implementation of a larger number of I/Os than conventional methods, enabling a large amount of information to be transmitted and received simultaneously. This paper proposes the Molded Bridge die on Substrate (MBoS) process technology, which combines molding and Redistribution Layer (RDL) processes. The proposed MBoS technology is expected to contribute to the popularization of next-generation packaging technology due to its easy adaption and wide application areas.

Keywords Molding, 2.5D Packaging, Bridge Die, Interposer

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