![](/html/templates/default/images/main/pic/journal01.png)
Search
- Past Issues
- e-Submission
-
KCI Accredited Journals KCI 등재지
KCI Impact Factor 0.54
Editorial Office
- +82-2-538-0962
- +82-2-538-0963
- kmeps@kmeps.or.kr
- http://kmeps.or.kr/
KCI Accredited Journals KCI 등재지
KCI Impact Factor 0.54
Journal of the Microelectronics and Packaging Society 2024;31(2):69-77. Published online: Jul, 25, 2024
DOI : doi.org/10.6117/kmeps.2024.31.2.069
Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the
form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts
and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of
electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in
mounting components through the conventional reflow process.
In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials,
to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an
induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration
of the magnetic flux and the degree of heating on the pad part through finite element method (FEM).
LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify
the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process
through magnetic induction that can overcome the limitations of the reflow method.
Keywords low heat resistant material, Induction heating soldering, electronic component mounting, MID, Induction Heating Selective Bonding