2024

Vol.31 No.2

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):69-77. Published online: Jul, 25, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.2.069

Magnetic Induction Soldering Process for Mounting Electronic Components on Low Heat Resistance Substrate Materials

  • Youngdo Kim1,2†, Jungsik Choi2 , Min-Su Kim3 , Dongjin Kim3 , Yong-Ho Ko3 , and Myung-Jin Chung1
    1 Robot Intelligent Control System Engineering, Graduate School of Convergence Technology and Energy, Tech University of Korea, 237, Sangidaehak-ro, Siheung-si, Gyeonggi-do 15073, Korea, 2 R&D Center, BS Technics, 97-5, Sandan-ro,163beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do 15429, Korea, 3 Micro-Joining Center, Korea Institute of Industrial Technology, 156, Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea
Corresponding author E-mail: jude.kim@bespokeplanet.kr
Abstract

Due to the miniaturization and multifunctionality of electronic devices, a surface mount technology in the form of molded interconnect devices (MID), which directly forms electrodes and circuits on the plastic injection parts and mounts components and parts on them, is being introduced to overcome the limitations in the mounting area of electronic components. However, when using plastic injection parts with low thermal stability, there are difficulties in mounting components through the conventional reflow process.
In this study, we developed a process that utilizes induction heating, which can selectively heat specific areas or materials, to melt solder and mount components without causing any thermal damage to the plastic. We designed the shape of an induction heating Cu coil that can concentrate the magnetic flux on the area to be heated, and verified the concentration of the magnetic flux and the degree of heating on the pad part through finite element method (FEM). LEDs, capacitors, resistors, and connectors were mounted on a polycarbonate substrate using induction heating to verify the mounting process, and their functionality was confirmed. We presented the applicability of a selective heating process through magnetic induction that can overcome the limitations of the reflow method.

Keywords low heat resistant material, Induction heating soldering, electronic component mounting, MID, Induction Heating Selective Bonding

REFERENCES
  • H. J. Ko, H. C. Kim, and H. Y. Yun, “Study on Fabrication of 3D MID Cruise Control Switch”, J. Mechanical Science and Technology, 1796-1797 (2013).
  • H. Y. Yun and H. C. Kim, “Basic Research For The 3DCD (3D Circuit Devices)”, J. Korean Soc. Precis. Eng., 31(12), 1061-1066 (2014).
  • H.-A. Yang, M. Wu, and W. Fan, “Localized induction heating solder bonding for wafer level MEMS packaging”, J. Micromech. Microeng., 15(2), 394-399 (2005).
  • Y.-S. Son, “Heat Transfer Analysis of Forced ConvectionInfrared Reflow Soldering Process with Air Injection", J. Welding and Joining, 16(4), 98-108 (1998).
  • J.-K. Choi, H.-S Bang, S. R. Rajesh, and H.-S. Bang, “Joining characteristics Sn-3.5Ag solder bump by induction heating”, KWS, 47, 181-183 (2006).
  • Y.-H. Lee, K.-Y. Lee, and T.-S. Oh, “COG(Chip On Glass)Bonding Technology for Flat Panel Display Using Induction Heating Body in AC Magnetic Field”, J. Microelectronics & Packaging Society, 12(4), 315-321 (2005).
  • J.-G. Kang, J.-H. Lee, and J.-G. Shin, “Numerical analysis of induction heating for the application of line heating”, Journal of the Society of Naval Architects of Korea, 37(3), 110-121(2000).
  • D. K. Cheng, “Field and Wave Electromagnetics”, 2nd Ed., Addison Wesley, USA (1979).
  • J. Jin, “The Finite Element Method in Electromagnetics”, John Wiley and Sons (1979).
  • W. H. Hayt, Jr. and J. A. Buck, “Engineering Electromagnetics”, 5th Ed., The MaGraw-Hill Companies, USA (1990).
  • S. Zinn, and S. L. Semiatin, “Elements of Induction Heating: Design, Control, and Applications”, Electric Power Research Institute ; ASM International, Palo Alto, CA (1988).
  • J.-K. Choi, K. Nam, J. K. Kim, H. Choi, and S.-S. Lee, “An Optimal Frequency Condition for An Induction Hardening for An Axle Shaft using Thermal-Electromagnetic Coupled Analysis”, Trans. Korean Soc. Mech. Eng. A, 40(2), 207-212 (2016).
  • T. L. Bergman, A. S. Lavine, F. P. Incropera, and D. P. Dewitt, “Introduction to Heat Transfer”, 2nd Ed., John Wiley and Sons, USA (1990).
  • E.-Y. Yoon, S.-W. Kim, Y.-S. Yang, S.-J. Lee, and G.-H. Lee, “A study on PCB Failure prediction of forced convection reflow soldering process with Thermal-Structure coupled simulation”, J. The Korean Society of Mechanical Engineers, 593-596 (2009).
  • Z. Yin, F. Sun, and M. Guo, “The fast formation of Cu-Sn intermetallic compound in Cu/Sn/Cu system by induction heating process”, Materials Letters, 215, 207-210 (2018).
  • D. Seehase, C. Kohlen, A. Neiser, A. Novikov, and M. Nowottnick, “Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors”, Periodica Polytechnica Electrical Engineering and Computer Science, 62(4), 172-180 (2018).
  • M. Drienovsky, M. Palcut, P. Priputen, E. Cuninková, O. Bošák, M. Kubliha, and L. R. Trnková, “Properties of Sn-AgCu Solder Joints Prepared by Induction Heating”, Advances in Materials Science and Engineering, 1724095 (2020).
  • M. Li, H. Xu, S.-W. R. Lee, J. Kim, and D. Kim, “Eddy Current Induced Heating for the Solder Reflow of Area Array Packages”, IEEE Transactions on Advanced Packaging, 31(2), 399-403 (2008).
  • H. J. Han, J. P. Jung, B. Y. Ha, Y. E. Shin, J. Y. Park, and C. S. Kang, “Reflow Soldering Characteristics of Sn-3.5Ag Balls for BGA”, Journal of Welding and Joining, 19(2), 39-44 (2001).