2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):63-68. Published online: Jul, 25, 2024

PDF Full Text XML

DOI : doi.org/10.6117/kmeps.2024.31.2.063

Application and Performance Evaluation of Photodiode-Based Planck Thermometry (PDPT) in Laser-Based Packaging Processes

  • Chanwoong Wi1 , Junwon Lee1 , Jaehyung Woo1 , Hakyung Jeong2 , Jihoon Jeong3 , and Seunghwoi Han1,†
    1 Department of Mechanical Engineering, Chonnam National University, Gwangju, Republic of Korea, 2 Korea Institute of Machinery & Materials, 3 Department of Industrial & System Engineering, Texas A&M University, College Station, TX, United States
Corresponding author E-mail: shan@chonnam.ac.kr
Abstract

With the increasing use of transparent displays and flexible devices, polymer substrates offering excellent flexibility and strength are in demand. Since polymers are sensitive to heat, precise temperature control during the process is necessary. The study proposes a temperature measurement system for the laser processing area within the polymer base, aiming to address the drawbacks of using these polymer bases in laser-based selective processing technology. It presents the possibility of optimizing the process conditions of the polymer substrate through local temperature change measurements in the laser processing area. We developed and implemented the PDPT (Photodiode-based Planck Thermometry) to measure temperature in the laser-processing area. PDPT is a non-destructive, contact-free system capable of real-time measurement of local temperature increases. We monitored the temperature fluctuations during the laser processing of the polymer substrate. The study shows that the proposed laser-based temperature measurement technology can measure real-time temperature during laser processing, facilitating optimal production conditions. Furthermore, we anticipate the application of this technology in various laser-based processes, including essential micro-laser processing and 3D printing.

Keywords Photodiode-based Planck Thermometry (PDPT), Laser-based packaging processes, Real-time temperature monitoring, High-resolution temperature measurement

REFERENCES
  • Y. Yan, Y. Zheng, H. Sun, and J. a. Duan, "Review of Issues and Solutions in High-Power Semiconductor Laser Packaging Technology", Frontiers in Physics, 9, 669591 (2021).
  • S. Jeon, R. Park, J. Jeong, and S. W. Hong, "Laser fabrication of graphene-based materials and their application in electronic devices", Journal of the Microelectronics and Packaging Society, 28(1), 1-12 (2021).
  • S. Nowotny, S. Scharek, E. Beyer, and K.-H. Richter, "Laser beam build-up welding: precision in repair, surface cladding, and direct 3D metal deposition", Journal of thermal spray technology, 16, 344-348 (2007).
  • Y.-Y. Zhao, et al., "Plasmon-enhanced nanosoldering of silver nanoparticles for high-conductive nanowires electrodes", Opto-Electronic Advances, 4(12), 200101 (2021).
  • C. R. Phipps, "Laser ablation and its applications", Springer, (2007).
  • C. Y. Yap, et al., "Review of selective laser melting: Materials and applications", Applied physics reviews, 2(4), 041101 (2015).
  • A. Sharif, N. Farid, and G. M. O'Connor, "Ultrashort laser sintering of metal nanoparticles: A review", Results in Engineering, 16, 100731 (2022).
  • J. Noh, J. Ha, and D. Kim, "Femtosecond and nanosecond laser sintering of silver nanoparticles on a flexible substrate", Applied Surface Science, 511, 145574 (2020).
  • S. J. Hwang, S. V. Hwang, and J. P. Jung, "Laser Micro Soldering and Soldering Factors", Journal of the Microelectronics and Packaging Society, 27(3), 1-8 (2020).
  • S. J. Hwang, H. J. Kang, J. O. Kim, and J. P. Jung, "Laser micro-joining and soldering", Journal of the Microelectronics and Packaging Society, 26(3), 7-13 (2019).
  • N. M. Bulgakova, V. P. Zhukov, A. Y. Vorobyev, and C. Guo, "Modeling of residual thermal effect in femtosecond laser ablation of metals: role of a gas environment", Applied Physics A, 92, 883-889 (2008).
  • Y. Levy, T. J.-Y. Derrien, N. M. Bulgakova, E. L. Gurevich, and T. Mocek, "Relaxation dynamics of femtosecond-laserinduced temperature modulation on the surfaces of metals and semiconductors", Applied Surface Science, 374, 157-164 (2016).
  • J. K. Chen, D. Y. Tzou, and J. E. Beraun, "Numerical investigation of ultrashort laser damage in semiconductors", International Journal of Heat and Mass Transfer, 48(3-4), 501-509 (2005).
  • S. Ravi‐Kumar, B. Lies, X. Zhang, H. Lyu, and H. Qin, "Laser ablation of polymers: A review", Polymer International, 68(8), 1391-1401 (2019).
  • J. L. Bennett, et al., "Cooling rate effect on tensile strength of laser deposited Inconel 718", Procedia Manufacturing, 26, 912-919 (2018).
  • P. A. Hooper, "Melt pool temperature and cooling rates in laser powder bed fusion", Additive Manufacturing, 22, 548-559 (2018).
  • Y. Gao, J. Xing, J. Zhang, N. Luo, and H. Zheng, "Research on measurement method of selective laser sintering (SLS) transient temperature", Optik, 119(13), 618-623 (2008).
  • R.-S. Huang, L.-M. Liu, and G. Song, "Infrared temperature measurement and interference analysis of magnesium alloys in hybrid laser-TIG welding process", Materials Science and Engineering: A, 447(1-2), 239-243 (2007).
  • B. M. Lane, S. P. Moylan, E. P. Whitenton, and L. Ma, "Thermographic measurements of the commercial laser powder bed fusion process at NIST", Rapid prototyping journal, 22(5), 778-787 (2016).
  • M. J. Ansari, D.-S. Nguyen, and H. S. Park, "Investigation of SLM process in terms of temperature distribution and melting pool size: Modeling and experimental approaches", Materials, 12(8), 1272 (2019).
  • J. Jeong, S. Webster, S. Liao, J.-E. Mogonye, K. Ehmann, and J. Cao, "Cooling rate measurement in directed energy deposition using photodiode-based planck thermometry (PDPT)", Additive Manufacturing Letters, 3, 100101 (2022).
  • M. Planck, "Über das gesetz der energieverteilung im normalspektrum", annalen der physik, 309(3), 553-563 (1978).
  • C. De Izarra and J.-M. Gitton, "Calibration and temperature profile of a tungsten filament lamp", European Journal of Physics, 31(4), 933 (2010).