2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(2); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(2):1-8. Published online: Jul, 25, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.2.001

Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating

  • Soojae Park1,†, Eunmin Cho1 , Myoungsik Baek1 , Eulgi Min2 , and Kyujung Choi2
    1 OxWires Co., Ltd., Pyeongtaek City, Korea, 2 NCD Co., Ltd., Daejeon City, Korea
Corresponding author E-mail: psj@oxwires.com
Abstract

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al2O3 passivation.

Keywords Insulated wire, Adhesively-promoted wire, Passivated wire, Al2O3 coating, Bonding wire, Nano ceramic

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