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Ultrasensitive Crack-based Mechanosensor Inspired by Spider’s Sensory Organ
https://doi.org/10.6117/kmeps.2024.31.1.001
Journal of the Microelectronics and Packaging Society 2024;31(1):1-6
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Research Trends in Thermal Interface Materials for Flexible and Stretchable Electronic Device
https://doi.org/10.6117/kmeps.2024.31.1.007
Journal of the Microelectronics and Packaging Society 2024;31(1):7-15
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State of Health and State of Charge Estimation of Li-ion Battery for Construction Equipment based on Dual Extended Kalman Filter
https://doi.org/10.6117/kmeps.2024.31.1.016
Journal of the Microelectronics and Packaging Society 2024;31(1):16-22
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Prediction of Maximum Bending Strain of a Metal Thin Film on a Flexible Substrate Using Finite Element Analysis
https://doi.org/10.6117/kmeps.2024.31.1.023
Journal of the Microelectronics and Packaging Society 2024;31(1):23-28
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Flexible Planar Heater Comprising Ag Thin Film on Polyurethane Substrate
https://doi.org/10.6117/kmeps.2024.31.1.029
Journal of the Microelectronics and Packaging Society 2024;31(1):29-34
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Properties of Cu Pillar Bump Joints during Isothermal Aging
https://doi.org/10.6117/kmeps.2024.31.1.035
Journal of the Microelectronics and Packaging Society 2024;31(1):35-42
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Electrical Properties of Two-dimensional Electron Gas at the Interface of LaAlO3/SrTiO3 by a Solution-based Process
https://doi.org/10.6117/kmeps.2024.31.1.043
Journal of the Microelectronics and Packaging Society 2024;31(1):43-48
About KMEPS
The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.
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