2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 28(1); 2021
  • Article

Review

Journal of the Microelectronics and Packaging Society 2021;28(1):31-37. Published online: Mar, 18, 2022

PDF Full Text XML

DOI : 10.6117/kmeps.2021.28.1.031

Characteristics of SAC305 and Nano-Particle Dispersed Solders

  • Jang Baeg Kim, Seong Min Seo, Hye Jun Kang, Do Hoon Cho, Sri Harini Rajendran, Jae Pil Jung†
    Department of Materials Science and Engineering, University of Seoul, Seoul 130-743, Korea
Corresponding author E-mail: jpjung@uos.ac.kr
Abstract

Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.

Keywords Sn-3wt%Ag-0.5wt%Cu solder, nano-composite solder, wetting, microstructure, tensile property