2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 29(2); 2022
  • Article

Review

Journal of the Microelectronics and Packaging Society 2022;29(2):107-112. Published online: Aug, 11, 2022

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DOI : 10.6117/kmeps.2022.29.2.107

Development of Solvent-Free Type for UV-Curable Silver Paste

  • Min Yong Jang1, Hyun Jin Nam2, and Su Yong Nam1,†
    1Department of Nanotechnology Engineering, Pukyong National University, 2Department of Materials Science and Engineering, Seoul National University of Science and Technology
Corresponding author E-mail: suynam@pknu.ac.kr
Abstract

본 연구에서는 용제를 전혀 사용하지않고 UV경화가 가능한 실버 페이스트를 개발하였다. 무용제(solvent-free) 타입으로 개발한 실버 페이스트의 점도 및 점탄성 측정하였다. 그리고 스크린인쇄로 패턴을 인쇄한 후에 UV경화로 전극 도막을 형성시켰다. 형성된 전극도막의 전도성, 연필경도, 접착력에 대해서 평가하였다. 마지막으로 전극도막의 경화특성 은 TGA 및 FT-IR로 평가하였다. 이러한 결과를 정리하면 전도성, 접착력, 경화특성에 대해서는 Paste(4), 즉 1.2 m의 구형 실버 파우더와 50 nm 실버 파우더를 72:8%로 혼합한 실버 페이스트가 가장 우수한 물성이 얻어짐을 알 수 있었다.
In this study, a silver paste capable of UV curing without using any solvent was developed. The viscosity and viscoelasticity of the silver paste developed as a solvent-free type were measured. And after printing the pattern by screen printing, an electrode coating film was formed by UV curing. Conductivity, pencil hardness, and adhesive force of the formed electrode coating film were evaluated. Finally, the curing characteristics of the electrode coating film were evaluated by TGA and FT-IR. Summarizing these results, in terms of conductivity, adhesion, and curing characteristics, it was found that Paste (4), that is, silver paste obtained by mixing 1.2 m spherical silver powder and 50 nm silver powder at 72:8% had the best physical properties.

Keywords Silver paste, UV-curing, Solvent-free, Conductivity, Adhesive