2024

Vol.31 No.2

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 29(4); 2022
  • Article

Review

Journal of the Microelectronics and Packaging Society 2022;29(4):89-94. Published online: Feb, 9, 2023

Formulaic Understanding to Make a Strategy of Thermal Conductivity Reduction for Enhancing the Performance of Thermoelectric Materials

  • Ji-Hee Pi1, Myung Sik Choi2,†, Kyu Hyoung Lee1,†
    1Department of Materials Science and Engineering, Yonsei University, 50 Yonsei-ro, Seoul 03722, South Korea, 2School of Energy Materials and Chemical Engineering, Kyungpook National University, 2559 Gyeongsang-daero, Sangju 37224, South Korea
Corresponding author E-mail: ms.choi@knu.ac.kr, khlee2018@yonsei.ac.kr
Abstract

고체상태에서 열에너지과 전기에너지를 직접적이고 가역적으로 변환할 수 있는 열전소재는 전기전도특성인 전기전도도 및 제벡계수와 열전도특성인 열전도도에 의해 그 성능이 결정된다. 하지만 전기전도도, 제벡계수, 열전도도는 소재의 조성, 결정구조 및 전자구조에 의해 결정되며, 서로 상관관계를 나타내기 때문에 성능 증대를 위한 효과적인 전략수립에 어려움이 있다. 본 논문에서는 열전소재의 성능과 관련한 수식에 대한 이해를 바탕으로 실험 결과와 연계하여 열전도도 저감 관점에서 효과적인 결함제어 기반 열전소재 성능 증대 전략을 수립할 수 있는 방법론을 제공하고자 한다.
Thermoelectric materials can directly convert a temperature gradient to an electrical energy and vice-versa, and their performance is determined by the electrical conductivity, Seebeck coefficient, and thermal conductivity. However, it is difficult to establish an effective strategy for enhancing performance since electrical conductivity, Seebeck coefficient, and thermal conductivity are strongly dependent on the composition, crystal structure, and electronic structure of the material, and show a correlation with each other. Herein, based on the understanding of the formulas related to the performance of thermoelectric materials, we provide a methodology to establish feasible defect engineering strategies of thermal conductivity reduction for improving the performance of thermoelectric materials in connection with the experimental results.

Keywords Thermoelectric, Formulaic understanding, Thermal conductivity, Defect engineering