2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(1); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(1):1-16. Published online: May, 8, 2023

PDF Full Text XML

DOI : doi.org/10.6117/kmeps.2023.30.1.01

Ag Sintering Die Attach Technology for Wide-bandgap Power Semiconductor Packaging

  • Min-Su Kim† and Dongjin Kim†
    Advanced Joining & Additive Manufacturing R&D Department / Micro-Joining Center, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Republic of Korea
Corresponding author E-mail: mskim927@kitech.re.kr, dongjinkim@kitech.re.kr
Abstract

Recently, the shift to next-generation wide-bandgap (WBG) power semiconductor for electric vehicle is accelerated due to the need to improve power conversion efficiency and to overcome the limitation of conventional Si power semiconductor. With the adoption of WBG semiconductor, it is also required that the packaging materials for power modules have high temperature durability. As an alternative to conventional high-temperature Pb-based solder, Ag sintering die attach, which is one of the power module packaging process, is receiving attention. In this study, we will introduce the recent research trends on the Ag sintering die attach process. The effects of sintering parameters on the bonding properties and methodology on the exact physical properties of Ag sintered layer by the realization 3D image are discussed. In addition, trends in thermal shock and power cycle reliability test results for power module are discussed.

Keywords Wide-bandgap, Power module, Ag sinter, Process parameter, Reliability

REFERENCES
  • R. Faria, P. Moura, J. Delgado, and A.T. De Almeida, "A sustainability assessment of electric vehicles as a personal mobility system", Energy Convers. Manag., 61, 19 (2012).
  • Yole Development, "Status of the power module packaging industry 2021" (2021).
  • L. Lorenz, T. Erlbacher, and O. Hilt, "Future technology trends", in: Wide bandgap power semiconductor packaging, K. Suganuma, Eds., pp. 3-53, Woodhead Publishing, Duxford (2018).
  • C. Buttay, D. Planson, B. Allard, D. Bergogne, P. Bevilacqua, C. Joubert, M. Lazar, C. Martin, H. Morel, D. Tournier, and C. Raynaud, "State of the art of high temperature power electronics", Mater. Sci. Eng. B, 176(4), 283 (2011).
  • K. Shenai, M. Dudley, and R. F. Davis, "Current status and emerging trends in wide bandgap (WBG) semiconductor power switching devices", ECS J. Solid State Sci. Technol., 2(8), N3055 (2013).
  • J. Biela, M. Schweizer, S. Waffler, and J. W. Kolar, "SiC versus Si - evaluation of potentials for performance improvement of inverter and DC-DC converter systems by SiC power semiconductors", IEEE Trans. Ind. Electron., 58(7), 2872 (2011).
  • E. Robles, A. Matallana, I. Aretxabaleta, J. Andreu, M. Fernandez, and J. L. Martin, "The role of power device technology in the electric vehicle powertrain", Int. J. Energy Res., 46, 22222 (2022).
  • Yole Development, "Power SiC: materials, devices and applications 2020" (2020).
  • Yole Development, "Status of the power module packaging industry 2019" (2019).
  • European Commission, End-of-Life Vehicles Directive, from https://environment.ec.europa.eu/topics/waste-and-recycling/ end-life-vehicles_en.
  • D. Kim, B. Lee, T.-I. Lee, S. Noh, C. Choe, S. Park, and M.- S. Kim, "Power cycling tests under driving ΔTj = 125 ℃ on the Cu clip bonded EV power module", Microelectron. Reliab., 138, 114652 (2022).
  • S. Menon, E. George, M. Osterman, and M. Pecht, "High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives", J. Mater. Sci. Mater. Electron., 26(6), 4021 (2015).
  • DA5 Consortium Customer Presentation (14/12/22 version) (2022).
  • K. S. Siow, "Mechanical properties of nano-silver joints as die attach materials", J. Alloys Compd., 514, 6 (2012).
  • E. Ide, S. Angata, A. Hirose, and K. F. Kobayashi, "Metalmetal bonding process using Ag metallo-organic nanoparticles", Acta Mater., 53(8), 2385 (2005).
  • M. H. Roh, H. Nishikawa, S. Tsutsumi, N. Nishiwaki, K. Ito, K. Ishikawa, A. Katsuya, N. Kamada, and M. Saito, "Pressureless bonding by micro-sized silver particle paste for hightemperature electronic packaging", Mater. Trans., 57(7), 1209 (2016).
  • J. Yeom, S. Nagao, C. Chen, T. Sugahara, H. Zhang, C. Choe, C.F. Li, and K. Suganuma, "Ag particles for sinter bonding: Flakes or spheres?", Appl. Phys. Lett., 114(25), 253103 (2019).
  • J. Yan, G. Zou, A. Wu, J. Ren, J. Yan, A. Hu, L. Liu, and Y. N. Zhou, "Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application", J. Phys. Conf. Ser., 379, 012024 (2012).
  • Z. Zhang, C. Chen, Y. Yang, H. Zhang, D. Kim, T. Sugahara, S. Nagao, and K. Suganuma, "Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air", J. Alloys Compd., 780, 435 (2019).
  • H. Zhang, W. Wang, H. Bai, G. Zou, L. Liu, P. Peng, and W. Guo, "Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications", J. Alloys Compd., 774, 487 (2019)
  • D. Kim, C. Chen, and K. Suganuma, "Microstructural and mechanical reliability of a GaN/DBA die-attached module with Ag sinter joining in harsh thermal environments", Proc. 20th International Conference on Electronic Packaging Technology (ICEPT), Hong Kong, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) (2019)
  • Z. Zhang, C. Chen, A. T. Wu, K. Suganuma, "Improvement of high-temperature thermal aging reliability of Ag-Au joints by modifying Ni/Au surface finish", J. Mater. Sci. Mater. Electron., 30, 20292 (2019).
  • D. Kim, C. Chen, S. J. Lee, S. Nagao, and K. Suganuma, "Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules", J. Mater. Sci. Mater. Electron., 31(4), 3715 (2020).
  • W. S. Hong, M. S. Kim, and K.-K. Hong, "Electrical and microstructural reliability of pressureless silver-sintered joints on silicon carbide power modules under thermal cycling and high-temperature storage", J. Electron. Mater., 50(3), 914
  • C. Chen, Z. Zhang, D. Kim, T. Sasamura, Y. Oda, M. C. Hsieh, A. Iwaki, A. Suetake, and K. Suganuma, "Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test", J. Alloys Compd., 862, 158596
  • M. Wang, Y. Mei, W. Hu, X. Li, and G. Q. Lu, "Pressureless sintered-silver as die attachment for bonding Si and SiC chips on silver, gold, copper, and nickel metallization for power electronics packaging: the practice and science", IEEE J. Emerg. Sel. Top. Power Electron., 10(2), 2645 (2022).
  • X. Shen, J. Li, and S. Xi, "High strength die-attach joint formation by pressureless sintering of organic amine modified Ag nanoparticle paste", Nanomaterials, 12, 3351 (2022).
  • Y. Liu, C. Chen, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, and K. Suganuma, "Reliability evaluation on Ag sintering die attach for SiC power modules during long-term thermal aging/cycling", Proc. 2022 International Conference on Electronic Packaging (ICEP), Sapporo, The Japan Institute of Electronics Packaging (JIEP) (2022).
  • M.-S. Kim and H. Nishikawa, "Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging", Microelectron. Reliab., 76-77, 420 (2017).
  • Y. Liu, C. Chen, Z. Zhang, M. Ueshima, T. Sakamoto, T. Naoe, H. Nishikawa, Y. Oda, and K. Suganuma, "Development of crack-less and deformation-resistant electroplated Ni/ electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock", Mater. Des., 224, 111389 (2022)
  • H. Zhang, C. Chen, S. Nagao, and K. Suganuma, "Thermal fatigue behavior of silicon-carbide-doped silver microflake sinter joints for die attachment in silicon/silicon carbide power devices", J. Electron. Mater., 46(2), 1055 (2017).
  • B.-S. Lee and J.-W. Yoon, "Die-attach for power devices using the Ag sintering process: Interfacial microstructure and mechanical strength", Met. Mater. Int., 23(5), 958 (2017).
  • Y. Liu, H. Zhang, L. Wang, X. Fan, G. Zhang, and F. Sun, "Effect of sintering pressure on the porosity and the shear strength of the pressure-assisted silver sintering bonding", IEEE Trans. Device Mater. Reliab., 18(2), 240 (2018)
  • J. W. Yoon, J. H. Back, and S. B. Jung, "Effect of surface finish metallization on mechanical strength of Ag sintered joint", Microelectron. Eng., 198, 15 (2018).
  • D. Kim, C. Chen, A. Suetake, C. Choe, T. Sugahara, S. Nagao, and K. Suganuma, "Development of thermal shockresistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure", Microelectron. Reliab., 88-90, 779 (2018).
  • C. Chen, K. Suganuma, T. Iwashige, K. Sugiura, and K. Tsuruta, "High-temperature reliability of sintered microporous Ag on electroplated Ag, Au, and sputtered Ag metallization substrates", J. Mater. Sci. Mater. Electron., 29(3), 1785 (2018).
  • L. M. Chew, T. Stegmann, E. Schwenk, M. Dubis, and W. Schmitt, "A new development of direct bonding to aluminum and nickel surfaces by silver sintering in air atmosphere", Proc. 69th Electronic Components and Technology Conference (ECTC), Las Vegas, 87, IEEE Components, Packaging and Manufacturing Technology Society (CPMT) (2019).
  • C. Oh, Y. Choi, D. Kim, M. Won, H. Yang, and W. Hong, "Effect of oxygen on pressureless silver sintering in a nitrogen atmosphere", J. Mater. Sci. Mater. Electron., 31(1), 488 (2020).
  • Z. Zhang, C. Chen, A. Suetake, M. C. Hsieh, and K. Suganuma, "Reliability of Ag sinter-joining die attach under harsh thermal cycling and power cycling tests", J. Electron. Mater., 50(12), 6597
  • S. K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y. C. Liu, S. G. Lin, and K. Suganuma, "Nano-volcanic eruption of silver", Sci. Rep., 6, 34769 (2016).
  • C. Chen, C. Choe, D. Kim, and K. Suganuma, "Lifetime prediction of a SiC power module by micron/submicron Ag sinter joining based on fatigue, creep and thermal properties from room temperature to high temperature", J. Electron. Mater., 50(3), 687 (2021).
  • G. Lu, G.Q. Lu, and Z. M. Xiao, "Mechanical properties of porous materials", J. Porous Mater., 6, 359 (1999).
  • M. Hakamada, M. Mabuchi, "Mechanical strength of nanoporous gold fabricated by dealloying", Scr. Mater., 56(11), 1003 (2007).
  • G. Pia, F. Delogu, "Coarsening of nanoporous Au: Relationship between structure and mechanical properties", Acta Mater., 99, 29 (2015).
  • K. S. Siow, '"Are sintered silver joints ready for use as interconnect material in microelectronic packaging?", J. Electron. Mater., 43(4), 947 (2014).
  • R. Kimura, Y. Kariya, N. Mizumura, and K. Sasaki, "Effect of sintering temperature on fatigue crack propagation rate of sintered Ag nanoparticles", Mater. Trans., 59(4), 612 (2018).
  • T. Suzuki, Y. Yasuda, T. Terasaki, T. Morita, Y. Kawana, D. Ishikawa, M. Nishimura, N. Hideo, and K. Kurafuchi, "Macroand micro-deformation behavior of sintered-copper die-attach material", IEEE Trans. Device Mater. Reliab., 18(1), 54 (2018).
  • P. Gadaud, V. Caccuri, D. Bertheau, J. Carr, and X. Milhet, "Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution", Mater. Sci. Eng. A., 669, 379 (2016)
  • C. Qian, T. Gu, P. Wang, W. Cai, X. Fan, G. Zhang, and J. Fan, "Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures", Microelectron. Reliab., 132, 114536 (2022).
  • W. Rmili, N. Vivet, S. Chupin, T. Le Bihan, G. Le Quilliec, and C. Richard, "Quantitative analysis of porosity and transport properties by FIB-SEM 3D imaging of a solder based sintered silver for a new microelectronic component", J. Electron. Mater., 45(4), 2242 (2016).
  • S. A. Letz, D. Zhao, and M. Marz, "Mesostructural impact on the macroscopic stress state and yield locus of porous polycrystalline silver", Mater. Des., 219, 110785 (2022).
  • K. H. N'Tsouaglo, X. Milhet, J. Colin, L. Signor, A. Nait-Ali, J. Creus, M. Gueguen, P. Gadaud, and M. Legros, "Timeresolved evolution of the 3D nanoporous structure of sintered Ag by X-ray nanotomography: role of the interface with a copper substrate", Adv. Eng. Mater., 24, 2100583 (2022).
  • X. Milhet, A. Nait-Ali, D. Tandiang, Y. J. Liu, D. Van Campen, V. Caccuri, and M. Legros, "Evolution of the nanoporous microstructure of sintered Ag at high temperature using insitu X-ray nanotomography", Acta Mater., 156, 310 (2018).
  • A. Elasser, "Silicon carbide for power devices: history, evaluation, applications, and prospects", International Workshop on Integrated Power Packaging (IWIPP), Toulouse, IEEE Power Electronics Society (PELS) (2019).
  • D. Kim, C. Chen, C. Pei, Z. Zhang, S. Nagao, A. Suetake, T. Sugahara, and K. Suganuma, "Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti / Ag metallization by using micron/submicron Ag sinter paste", Jpn. J. Appl. Phys., 58(SB), SBBD15 (2019).
  • D. Kim, C. Chen, S. Noh, S. J. Lee, Z. Zhang, Y. Kimoto, T. Sugahara, and K. Suganuma, "Development of highstrength and superior thermal shock-resistant GaN/DBA die attach structure with Ag sinter joining by thick Ni metallization", Microelectron. Reliab., 100-101, 113380 (2019).
  • D. Kim, S. Lee, C. Chen, S. J. Lee, S. Nagao, and K. Suganuma, "Fracture mechanism of microporous Ag-sintered joint in a GaN power device with Ti/Ag and Ni/Ti/Ag metallization layer at different thermo-mechanical stresses", J. Mater. Sci., 56(16), 9852
  • C. Chen, Z. Zhang, D. Kim, T. Sasamura, Y. Oda, M.C. Hsieh, A. Iwaki, A. Suetake, and K. Suganuma, "Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test", J. Alloys Compd., 862, 158596 (2021).
  • U. M. Choi, S. Jorgensen, F. Iannuzzo, and F. Blaabjerg, "Power cycling test of transfer molded IGBT modules by advanced power cycler under different junction temperature swings", Microelectron. Reliab., 88-90, 788 (2018).
  • D. Kim, S. Nagao, C. Chen, N. Wakasugi, Y. Yamamoto, A. Suetake, T. Takemasa, T. Sugahara, and K. Suganuma, "Online thermal resistance and reliability characteristic monitoring of power modules with Ag sinter joining and Pb, Pbfree solders during power cycling test by SiC TEG chip", IEEE Trans. Power Electron., 36(5), 4977 (2021).