2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(1); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(1):17-29. Published online: May, 11, 2023

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DOI : dx.doi.org/10.6117/kmeps.2023.30.1.017

Solder Alloy Types and Solder Joint Reliability Evaluation Techniques

  • KimYou-Gwon1, KimHeon-Su1, KimTae-Wan1, KimHak-Sung1,2,†
    1Department of Mechanical Convergence Engineering, Hanyang University, Wangsimni-ro, Seongdong-gu, Seoul 04763, korea, 2Institute of Nanoscience and Technology, Hanyang University, Wangsimni-ro, Seongdong-gu, Seoul 04763, korea
Corresponding author E-mail: kima@hanyang.ac.kr
Abstract

In this paper, a method for evaluating the reliability of solder joints is introduced, as they play a crucial role in packaging technology due to the miniaturization and high-performance requirements of electronic device. Firstly, properties of solder based on various alloy compositions and solder types are described, followed by an analysis of solder joint structures in different packages. Next, the influence of solder alloy composition and microstructure on the thermal and mechanical properties of solder is analyzed, and solder creep behavior is briefly introduced. Subsequently, analytical techniques considering creep models and fatigue models for reliability evaluation are presented, and various ways to improve the reliability of solder joints are discussed. This study is expected to provide valuable information for evaluating and enhancing the reliability of solder joints in the semiconductor packaging technology field.

Keywords Package, Solder joint reliability, Creep model, Fatigue model, Microstructure

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