![](/html/templates/default/images/main/pic/journal01.png)
Search
- Past Issues
- e-Submission
-
KCI Accredited Journals KCI 등재지
KCI Impact Factor 0.54
Editorial Office
- +82-2-538-0962
- +82-2-538-0963
- kmeps@kmeps.or.kr
- http://kmeps.or.kr/
KCI Accredited Journals KCI 등재지
KCI Impact Factor 0.54
Journal of the Microelectronics and Packaging Society 2023;30(1):30-41. Published online: May, 11, 2023
DOI : doi.org/10.6117/kmeps.2023.30.1.030
With the aggressive down-scaling of advanced integrated circuits (ICs), electronic packages have become the bottleneck of both reliability and performance of whole electronic systems. In order to resolve the reliability issues, Institute of Electrical and Electronics Engineers (IEEE) laid down a roadmap on fault detection and diagnosis (FDD), thrusting the digital twin: a combination of reliability physics and artificial intelligence (AI). In this paper, we especially review research works regarding the signal-based FDD approaches on the electronic packages. We also discuss the research trend of FDD utilizing AI techniques.
Keywords Artificial Intelligence, Reliability Physics, Electronic Packaging, Fault Detection and Diagnosis