2024

Vol.31 No.3

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Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(1); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(1):49-54. Published online: May, 11, 2023

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DOI : doi.org/10.6117/kmeps.2023.30.1.049

Development Trend of Ni-less Surface Treatment Technology for Semiconductor Packaging Substrates

  • Min-Kyo Cho1, Jin-Ki Cho1, Kyoung-Min Kim1,†, Sung Yong Kim2, Deok-Gon Han3, and Tae-Hyun Sung3
    1 Department of Material Engineering, Tech University of Korea, 237. Sangidaehak-ro, Siheung-si, Gyeonggi-do, Korea, 2 Dept. of Electronics Eng., Tech University of Korea, 237. Sangidaehak-ro, Siheung-si, Gyeonggi-do, Korea, 3 MK Chem & Tech Co., Ltd, 167 Sanseong-ro, Danwon-gu, Ansan-si, Gyeonggi-do, 15434 Korea
Corresponding author E-mail: kkm386@tukorea.ac.kr
Abstract

Recently, System in Packaging(SIP) technology needs to meet high frequency (5G and more) communication technology and fine pitch surface treatment. The conventional Electroless Ni/Immersion Au plating(ENIG) is not suitable for high frequency range because of magnetic properties are increasing the transmission loss. Without nickel plating layer, the pattern and pad reliability level must be meet the condition. In this review paper, we investigated research trends on Ni-less surface treatment technology for high-frequency communication and frequency characteristics according to materials.

Keywords SiP, Transmission Loss, Surface Finish Technology, EPIG, DEG, Magnetic Properties

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