2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(1); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(1):55-62. Published online: May, 11, 2023

PDF Full Text XML

DOI : dx.doi.org/10.6117/kmeps.2023.30.1.055

A Study of Transient Liquid Phase Bonding with Ni-foam/Sn-3.0Ag-0.5Cu Composite Solder for EV Power Module Package Application

  • Young-Jin Seo, Min-Haeng Heo, and Jeong-Won Yoon†
    Department of Advanced Materials Engineering, Chungbuk National University, Chungdae-ro, Seowon-gu, Cheongju, Chungbuk 28644, Korea
Corresponding author E-mail: jwyoon@chungbuk.ac.kr
Abstract

In this study, Sn-3.0Ag-0.5Cu (wt.%, SAC305) solder dipping process was performed between Ni-foam skeleton with different pore per inch (PPI) to fabricate Ni-foam/SAC305 composite solder, and then applied to the transient liquid phase (TLP) bonding process to evaluate the microstructure and mechanical properties of the bonded joint. The Ni-foam/SAC305 composite solder preform consisted of Ni-foam and SAC305, and an intermetallic compound (IMC) having a (Ni,Cu)3Sn4 composition was formed at the Ni-foam interface. During TLP bonding process, the IMC at the Ni-foam interface was converted to (Ni,Cu)3Sn4+Au, and as the bonding time increased, the Ni-foam and SAC305 continuously reacted, and the bonded joint was converted into an IMC. And it was confirmed that the 130 PPI Ni-foam/ SAC305 composite solder joint was converted into an IMC at the fastest rate. As a result of performing a shear test to confirm the effect of Ni-foam on mechanical properties, solder joints under all conditions exhibited excellent mechanical properties of 50 MPa or more in the early stages of the TLP bonding process, and the shear strength tends to increase as the bonding time increases.

Keywords Sn-3.0Ag-0.5Cu solder, Nickel foam, Intermetallic compound, Mechanical properties, Transient liquid phase bonding

REFERENCES
  • K. Y. Kim, K. D. Min, Y. I. Kim, J. W. Yoon, and S. B. Jung, "The effect of environmental test on the shear strength of the ultrasonic bonded Cu terminal for power module", J. Weld. Join., 37(2), 1-6 (2019). https://doi.org/10.5781/JWJ.2019.37.2.1
  • D. H. Jung, M. H. Roh, J. H. Lee, K. H. Kim, and J. P. Jung, "Transient Liquid Phase (TLP) Bonding of device for high temperature operation", J. Microelectron. Electron. Packag., 24(1), 17-25 (2017). https://doi.org/10.6117/kmeps.2017.24.1.017
  • S. J. Baek, G. W. Jeong, J. H. Son, M. S. Kim, H. B. R. Lee, J. S. Kim, and Y. H. Ko, "Interfacial re actions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni (P) and Ni/Sn/(OSP) Cu structures for power modules", J. Mater. Sci.: Mater. Electron, 32, 3324-3333 (2021). https://doi.org/10.1007/s10854-020-05080-1
  • Y. Cheon, "Review of global carbon neutral strategies and technologies", J. Korean Soc., 59(1), 99-112 (2022).
  • J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power module packaging technology with extended reliability for electric vehicle applications", J. Microelectron. Electron. Packag., 21(4), 1-13 (2014).
  • H. J. Kang and J. P. Jung, "TLP and wire bonding for power module", J. Microelectron. Electron. Packag., 26(4), 7-13 (2019).
  • I. Nistor, A. Mihaila, M. Rahimo, L. Storasta, and C. Corvasce, "Wide bandgap power devices in megawatt applications", Power Electronics Europe, 4, 35 (2012).
  • M. K. Kim and S. W. Yoon, "Miniaturized design of a piezoelectric thermal sensor optimized for the integration to wide bandgap power modules operating at high temperatures", In 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 767-771 (2017).
  • L. Yang, Y. Xiong, Y. Zhang, W. Jiang, and D. Wei, "Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding", J. Mater. Sci.: Mater. Electron., 30, 18211-18219 (2019). https://doi.org/10.1007/s10854-019-02175-2
  • W. S. Hong and C. M. Oh, "Degradation behavior of solder joint and implementation technology for lead-free automotive electronics", J. Weld. Join., 31(3), 22-30 (2013).
  • J. H. Son, M. K. Kim, D. Y. Yu, Y. H. Ko, J. W. Yoon, C. W. Lee, Y. B. Park, and J. H. Bang, "Thermal aging characteristics of Sn-xSb solder for automotive power module", J. Weld. Join., 35(5), 38-47 (2017). https://doi.org/10.5781/JWJ.2017.35.5.6
  • N. Y. Lee, J. H. Lee, and C. Y. Hyun, "Chip sinter-bonding using Ag-based paste for power semiconductor devices", J. Weld. Join., 37(5), 482-492 (2019). https://doi.org/10.5781/JWJ.2019.37.5.8
  • H. Feng, J. Huang, X. Peng, Z. Lv, Y. Wang, J. Yang, S. Chen, and X. Zhao, "Microstructural evolution of Ni-Sn transient liquid phase sintering bond during high-temperature aging", J. Electron. Mater., 47, 4642-4652 (2018). https://doi.org/10.1007/s11664-018-6336-0
  • H. Xu, Y. Shen, Y. Hu, J. Li, and J. Xu, "Fabrication of highly reliable joint based on Cu/Ni/Sn double-layer powder for high temperature application", J. Microelectron. Electron. Packag., 16(4), 188-195 (2019). https://doi.org/10.4071/imaps.960671
  • J. F. Silvain, L. Constantin, J. M. Heintz, S. Bordere, L. Teule-Gay, Y. F. Lu, J. L. Diot, R. D. Langlade, and E. Feuillet, "Controlling interfacial exchanges in liquid phase bonding enables formation of strong and reliable Cu-Sn soldering for high-power and temperature applications", ACS Appl. Electron. Mater., 3(2), 921-928 (2021). https://doi.org/10.1021/acsaelm.0c01040
  • D. Ishikawa, B. N. An, M. Mail, H. Wurst, B. Leyrer, T. Blank, M. Weber, S. Ueda, H. Nakako, and Y. Kawana, "Analysis of bonding interfaces of pressureless-sintered Cu on metallization layers", In 2019 International Conference on Electronics Packaging (ICEP), 167-172 (2019).
  • D. H. Lee, M. H. Heo, and J. W. Yoon, "Recent studies of transient liquid phase bonding technology for electric vehicles", J. Weld. Join., 40(3), 233-241 (2022). https://doi.org/10.5781/JWJ.2022.40.3.4
  • J. H. Lee, D. H. Jung, and J. P. Jung, "Transient liquid phase diffusion bonding technology for power semiconductor packaging", J. Microelectron. Electron. Packag., 25(4), 9-15 (2018).
  • Z. Li, M. Li, Y. Xiao, and C. Wang, "Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves", Ultrason Sonochem., 21(3), 924-929 (2014).
  • J. W. Yoon, M. H. Heo, Y. J. Seo, D. H. Lee, M. S. Jeong, and H. T. Kim, "Semiconductor device bonding material comprising solder-coated metal foam", Korea patent 10-2022-0126915, filed October 4, 2022.
  • W. Zhang, Y. Cao, J. Huang, W. Zhao, X. Liu, M. Li, and H. Ji, "Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties", Ultrason Sonochem., 66, 105090 (2020).
  • H. Feng, J. Huang, J. Zhang, X. Zhai, X. Zhao, and S. Chen, "High temperature resistant Ni-Sn transient liquid phase sintering bonding for new generation semiconductor power electronic devices", In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-4 (2015).