2024

Vol.31 No.3

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(2); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(2):1-12. Published online: Aug, 18, 2023

Recent Progress in Micro In‐Mold Process Technologies and Their Applications

  • Sung Hyun Kim1 , Young Woo Kwon1 , and Suck Won Hong1,2,3,†
    1 Engineering Research Center for Color-Modulated Extra-Sensory Perception Technology, Pusan National University, 30 Jangjeon-dong, Geumjeong-gu, Busan 46241, Korea, 2 Department of Cogno-Mechatronics Engineering, College of Nanoscience and Nanotechnology, Pusan National University, 30 Jangjeon-dong, Geumjeong-gu, Busan 46241, Korea, 3 Department of Optics and Mechatronics Engineering, College of Nanoscience and Nanotechnology, Pusan National University, 30 Jangjeon-dong, Geumjeong-gu, Busan 46241, Korea
Corresponding author E-mail: swhong@pusan.ac.kr
Abstract

In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.

Keywords in-mold electronics, IME, soft electronics, flexible printed electronics, healthcare device

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