2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(2); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(2):21-32. Published online: Aug, 18, 2023

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DOI : doi.org/10.6117/kmeps.2023.30.2.021

Review on Oxidation Resistance Technology for Copper Nanowire Transparent Electrodes

  • Gieop Lee1 , Hokyun Rho2 , Hyung Gu Kim3 , and Jun-Seok Ha1,2,†
    1 Department of Chemical Engineering, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea, 2 Energy Convergence Core Facility, Chonnam National University, Gwangju 61186, Republic of Korea, 3 Photonic Semiconductor Research Center, Korea Photonics Technology Institute, Buk-gu, Gwangju 61007, Republic of Korea
Corresponding author E-mail: jsha@jnu.ac.kr
Abstract

CuNWs(Copper nanowires) are attracting attention as a transparent electrode material because of their excellent electrical conductivity, high mechanical flexibility, and cost-effectiveness. However, since copper nanowires are easily oxidized, there is a disadvantage that properties of the transparent electrode may be deteriorated due to this, and researches are being conducted to improve this. Accordingly, in this review, various methods and studies to prevent oxidation and improve stability of copper nanowire transparent electrodes by using coating materials such as carbon-based materials, metals, and conductive polymers are introduced. Through this, we intend to provide solutions to solve the problem of development and oxidation of copper nanowire-based technology

Keywords Cu Nanowire, Transparent Electrode, Oxidation Resistance

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