2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(3); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(3):11-19. Published online: Nov, 9, 2023

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DOI : doi.org/10.6117/kmeps.2023.30.3.011

Artificial Intelligence Semiconductor and Packaging Technology Trend

  • Hee Ju Kim and Jae Pil Jung†
    Department of Materials Science & Engineering, University of Seoul, Seoul, Rep. of Korea
Corresponding author E-mail: jpjung@uos.ac.kr
Abstract

Recently with the rapid advancement of artificial intelligence (AI) technologies such as Chat GPT, AI semiconductors have become important. AI technologies require the ability to process large volumes of data quickly, as they perform tasks such as big data processing, deep learning, and algorithms. However, AI semiconductors encounter challenges with excessive power consumption and data bottlenecks during the processing of large-scale data. Thus, the latest packaging technologies are required for AI semiconductor computations. In this study, the authors have described packaging technologies applicable to AI semiconductors, including interposers, Through-Silicon-Via (TSV), bumping, Chiplet, and hybrid bonding. These technologies are expected to contribute to enhance the power efficiency and processing speed of AI semiconductors

Keywords Artificial Intelligence (AI), 2.5-dimensional packaging, Through-Si-Via (TSV), Chiplet, Hybrid bonding

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