2024

Vol.30 No.4

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(3); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(3):35-39. Published online: Nov, 9, 2023

Technology Trends of Semiconductor Package for ESG

  • Minsuk Suh
    PKG development, SK hynix, 2091, Gyeongchung-daero, Bubal-eub, Icheon-si Gyeonggi-do, 17336, Korea
Corresponding author E-mail: minsuk.suh@sk.com
Abstract

ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

Keywords ESG(Environment, Social, Governance), TSV(Through Si Via), Fine pitch I/O(input/output), Heat Dissipation, Energy Consumption, Recycle

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