2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(3); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(3):64-72. Published online: Nov, 9, 2023

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DOI : doi.org/10.6117/kmeps.2023.30.3.064

Retarding Effect of Transferred Graphene Layers on Intermetallic Compound Growth at The Interface between A Substrate and Pb-free Solder

  • Yong-Ho Ko† , Dong-Yurl Yu
    Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology (KITECH), 156, Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea
Corresponding author E-mail: yonghoko@kitech.re.kr
Abstract

In this study, after transferring graphene on a Cu substrate and printing a Sn-3.0Ag-0.5Cu Pb-free solder paste on the Cu substrate, effects of the transferred graphene on formations and growths of intermetallic compound (IMC) at the interface between the Cu substrate and the solder were reported during processes of reflow soldering and isothermal aging for 1000 h with various temperatures (125, 150, and 175 ℃). Thicknesses of Cu6Sn5 and Cu3Sn IMCs at the interfaces with graphene were decreased during the reflow soldering and isothermal aging processes compared to those without graphene. The transferred graphene layers also showed that the growth rate constant and square of growth rate constant which related to the growth mechanisms of Cu6Sn5 and Cu3Sn IMCs with the temperature and time of the isothermal aging c ould dramatically decreased.

Keywords Cu substrate, Sn-3.0Ag-0.5Cu, transferred graphene, intermetallic compound, reflow soldering, isothermal aging

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