2024

Vol.31 No.3

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 25(4); 2018
  • Article

Review

Journal of the Microelectronics and Packaging Society 2018;25(4):9-15. Published online: Feb, 1, 2019

Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging

  • Jeong-Hyun Lee1, Do-hyun Jung2, Jae-Pil Jung1, †
    1Department of Materials Science and Engineering, University of Seoul 2Lightweight Materials Technology Center
Corresponding author E-mail: jpjung@uos.ac.kr
Abstract

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

Keywords Transient liquid phase bonding, Power module, High temperature, SiC, Solder.