2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(3); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(3):88-93. Published online: Nov, 9, 2023

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DOI : doi.org/10.6117/kmeps.2023.30.3.088

Design for Enhanced Precision in 300 mm Wafer Full-Field TTV Measurement

  • An-Mok Jeong and Hak-Jun Lee†
    Department of Smart Manufacturing R&D System, Korea Institute of industrial Technology, 89, Yangdaegiro-gil, Ipjang-myeon, Seobuk-gu, Cheonan-si, Chungcheongnam-do, Korea
Corresponding author E-mail: hak1414@kitech.re.kr
Abstract

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 μm.

Keywords Total thickness variation(TTV), High bandwidth memory(HBM), Cattier wafer, Device wafer, Temporary bonding & debonding(TBDB)

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