Vol.30 No.4

Editorial Office


  • Journal of the Microelectronics and Packaging Society
  • Volume 30(3); 2023
  • Article


Journal of the Microelectronics and Packaging Society 2023;30(3):111-118. Published online: Nov, 9, 2023

Study on Structural Changes and Electromagnetic Interference Shielding Properties of Ti-based MXene Materials by Heat Treatment

  • Han Xue1 , Ji Soo Kyoung2 , and Yun Sung Woo1,†
    1 Department of Materials Science and Engineering, Dankook University, Dandae-ro 119, Dongnam-gu, Cheonan-si, Chungnam 31116, Korea, 2 Department of Physics, Dankook University, Dandae-ro 119, Dongnam-gu, Cheonan-si, Chungnam 31116, Korea
Corresponding author E-mail: yunswoo@dankook.ac.kr

MXene, a two-dimensional transition metal carbide or nitride, has recently attracted much attention as a lightweight and flexible electromagnetic shielding material due to its high electrical conductivity, good mechanical strength and thermal stability. In particular, the Ti-based MXene, Ti3C2Tx and Ti2CTx are reported to have the best electrical conductivity and electromagnetic shielding properties in the vast MXene family. Therefore, in this study, Ti3C2Tx and Ti2CTx films were prepared by vacuum filtration using Ti3C2Tx and Ti2CTx dispersions synthesized by interlayer metal etching and centrifugation of Ti3AlC2 and Ti2AlC. The electrical conductivity and electromagnetic shielding efficiency of the films were measured after heat treatment at high temperature. Then, X-ray diffraction and photoelectron spectroscopy were performed to analyze the structural changes of Ti3C2Tx and Ti2CTx films after heat treatment and their effects on electromagnetic shielding. Based on the results of this study, we propose an optimal structure for an ultra-thin, lightweight, and high performance MXene-based electromagnetic shielding film for future applications in small and wearable electronics.

Keywords MXene, Ti3C2Tx, Ti2CTx, heat treatment, EMI shielding material

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