2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 30(4); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(4):1-7. Published online: Feb, 20, 2024

PDF Full Text XML

DOI : doi.org/10.6117/kmeps.2023.30.4.001

Recent Advances in 3D/4D Printed Electronics and Biomedical Applications

  • Hyojun Lee and Daehoon Han†
    School of Chemical Engineering, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea
Corresponding author E-mail: dhhan@jnu.ac.kr
Abstract

The ability of 3D/4D printing technology to create arbitrary 3D structures provides a greater degree of freedom in the design of printed structures. This capability has influenced the field of electronics and biomedical applications by enabling the trends of device miniaturization, customization, and personalization. Here, the current stateof-the-art knowledge of 3D printed electronics and biomedical applications with the unique and unusual properties enabled by 3D/4D printing is reviewed. Specifically, the review encompasses emerging areas involving recyclable and degradable electronics, metamaterial-based pressure sensor, fully printed portable photodetector, biocompatible and high-strength teeth, bioinspired microneedle, and transformable tube array for 3D cell culture and histology.

Keywords 3D printing, 4D printing, Electronics, Biomedical applications

REFERENCES
  • I. Gibson, D. Rosen, B. Stucker, M. Khorasani, "Additive manufacturing technologies", Springer, (2021).
  • M. Srivastava and S. Rathee, "Additive manufacturing: Recent trends, applications and future outlooks", Prog. Addit. Manuf., 7(2), 261-287 (2022).
  • S. Tibbits, "4d printing: Multi-material shape change", Archit. Des., 84(1), 116-121 (2014).
  • K. D. Ahn, "Fabrication of fluorescent oxygen sensor probe module based on planner lightwave circuits using uv imprint lithography", J. Microelectron. Packag. Soc., 25(3), 37-41 (2018).
  • Y.-S. Park and S.-K. Kang, "3d printed electronics research trend", J. Microelectron. Packag. Soc., 28(2), 1-12 (2021).
  • S. H. Kim, Y. W. Kwon and S. W. Hong, "Recent progress in micro in-mold process technologies and their applications", J. Microelectron. Packag. Soc., 30(2), 1-12 (2023).
  • H. W. Tan, Y. Y. C. Choong, C. N. Kuo, H. Y. Low and C. K. Chua, "3D printed electronics: Processes, materials and future trends", Prog. Mater. Sci., 127, 100945 (2022).
  • Y. Guo, S. Chen, L. Sun, L. Yang, L. Zhang, J. Lou and Z. You, "Degradable and fully recyclable dynamic thermoset elastomer for 3d-printed wearable electronics", Adv. Funct. Mater., 31(9), 2009799 (2021).
  • H.-G. Kim, S. Hajra, H. Lee, N. Kim and H. J. Kim, "Additively manufactured mechanical metamaterial-based pressure sensor with tunable sensing properties for stance and motion analysis", Adv. Eng. Mater., 25(14), 2201499 (2023).
  • Ouyang, R. Su, D. W. H. Ng, G. Han, D. R. Pearson and M. C. McAlpine, "3D printed skin-interfaced uv-visible hybrid photodetectors", Adv. Sci., 9(25), 2201275 (2022).
  • B. H. Robinson, "E-waste: An assessment of global production and environmental impacts", Sci. Total Environ., 408(2), 183-191 (2009).
  • J. M. Moon and S.-K. Kang, "Transient electronics and biodegradable encapsulation technologies", J. Microelectron. Packag. Soc., 28(2), 13-28 (2021).
  • V. R. Feig, H. Tran and Z. Bao, "Biodegradable polymeric materials in degradable electronic devices", ACS Central Sci., 4(3), 337-348 (2018).
  • J. U. Surjadi, L. G ao, H. Du, X. Li, X. Xiong, N. X. Fang and Y. Lu, "Mechanical metamaterials and their engineering applications", Adv. Eng. Mater., 21(3), 1800864 (2019).
  • Y. Bozkurt and E. Karayel, "3D printing technology; methods, biomedical applications, future opportunities and trends", J. Mater. Res. Technol., 14, 1430-1450 (2021).
  • M. Zhao, D. Yang, S. Fan, X. Yao, J. Wang, M. Zhu and Y. Zhang, "3d-printed strong dental crown with multi-scale ordered architecture, high-precision, and bioactivity", Adv. Sci., 9(5), 2104001 (2022).
  • D. Han, R. S. Morde, S. Mariani, A. A. La Mattina, E. Vignali, C. Yang, G. Barillaro and H. Lee, "4d printing of a bioinspired microneedle array with backward-facing barbs for enhanced tissue adhesion", Adv. Funct. Mater., 30(11), 1909197 (2020).
  • C. Yang, J. Luo, M. Polunas, N. Bosnjak, S. T. D. Chueng, M. Chadwick, H. E. Sabaawy, S. A. Chester, K. B. Lee and H. Lee, "4d-printed transformable tube array for high-throughput 3d cell culture and histology", Adv. Mater., 32(40), 2004285 (2020).
  • C. Shao, B. Jin, Z. Mu, H. Lu, Y. Zhao, Z. Wu, L. Yan, Z. Zhang, Y. Zhou and H. Pan, "Repair of tooth enamel by a biomimetic mineralization frontier ensuring epitaxial growth", Sci. Adv., 5(8), aaw9569 (2019).
  • H.-P. Yu, Y.-J. Zhu and B.-Q. Lu, "Dental enamel-mimetic large-sized multi-scale ordered architecture built by a well controlled bottom-up strategy", Chem. Eng. J., 360, 1633-1645 (2019).
  • S. Baik, H. J. Lee, D. W. Kim, J. W. Kim, Y. Lee and C. Pang, "Bioinspired adhesive architectures: From skin patch to integrated bioelectronics", Adv. Mater., 31(34), 1803309 (2019).