Journal of the Microelectronics and Packaging Society

Recently, electric semiconductors became an issue because of efficient use of energy and compaction of electronics. Silicon electric semiconductors are difficult to put into it because of its physical limitations. Hence, the study of WBG (Wideband Gap) semiconductors like SiC and GaN began. These devices received attention because it can be miniaturized and worked at high temperatures over 300°C. WBG MOSFET electric semiconductors can show performance like silicon IGBT. This can solve the current problem of IGBT tail. The current study shows the technical principles and issues related to SiC and GaN power semiconductors. WBG devices can achieve high performance compared to silicon, but its performance can’t be fully utilized because of lack in bonding technology. Therefore, this review introduces research on WBG devices and their packaging issues.

Keywords WBG, SiC, GaN, Power semiconductor, Power module.