2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 30(4); 2023
  • Article

Review

Journal of the Microelectronics and Packaging Society 2023;30(4):61-68. Published online: Feb, 20, 2024

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DOI : doi.org/10.6117/kmeps.2023.30.4.061

Study on Sn-Ag-Fe Transient Liquid Phase Bonding for Application to Electric Vehicles Power Modules

  • Byungwoo Kim1 , Hyeri Go1 , Gyeongyeong Cheon2 , Yong-Ho Ko2 , and Yoonchul Sohn1†
    1Dept. of Welding & Joining Science Engineering, Chosun University 309 Pilmoon-daero, Dong-gu, Gwangju 61452, Korea, 2Advanced Joining & Additive Manufacturing R&D Department, Korea Institute of Industrial Technology, 156 Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea
Corresponding author E-mail: yoonchul.son@chosun.ac.kr
Abstract

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn2 IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni3Sn4/FeSn2/Ni3Sn4 was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni3Sn4/FeSn2 interface and then propagated into FeSn2. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200°C. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.

Keywords Sn-Ag-Fe, composite solder, TLP bonding, power module

REFERENCES
  • H. Choi, "Overview of silicon carbide power devices", Fairchild semiconductor (2016).
  • H. Lee, V. Semt, and R. Tummala, "A review of SiC power module packaging technologies: challenges, advances, and emerging issues", IEEE. J. Emerg. Sel. Top. Power. Electron., 8(1), 239-255 (2019).
  • X. She, A. Huang, O. Lucia, and B. Ozpineci, "Review of silicon carbide power devices and their applications", IEEE. Trans. Ind. Electron., 64(10), 8193-8205 (2017).
  • J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications", Journal of the Microelectronics and Packaging Society, 21(4), 1-13 (2014).
  • Y. J. Seo, M. H. Heo, and J. W. Yoon, "A Study of Transient Liquid Phase Bonding with Ni-foam/Sn-3.0Ag-0.5Cu Composite Solder for EV Power Module Package Application", Journal of the Microelectronics and Packaging Society, 30(1), 55-62 (2023).
  • M. S. Kim and D. J. Kim, "Ag Sintering Die Attach Technology for Wide-bandgap Power Semiconductor Packaging", Journal of the Microelectronics and Packaging Society, 30(1), 1-16 (2023).
  • H. J. Kang and J. P. Jung, "TLP and Wire Bonding for Power Module", Journal of the Microelectronics and Packaging Society, 26(4), 7-13 (2019).
  • A. Sharif, C. L. Gan, and Z. Chen, "Transient liquid phase Ag-based solder technology for high-temperature packaging applications", J. Alloys. Compd., 587, 365-368 (2014).
  • K. Chu, Y. C. Sohn, and C. Y. Moon, "A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding", Scr. Mater., 109, 113-117 (2015).
  • V. Chidambaram, J. Hattel, and J. Hald, "High-temperature lead-free solder alternatives", Microelectron. Eng., 88(6), 981-989 (2011).
  • N. Saud and R. M. Said, "Transient liquid phase bonding for solder-a short review", IOP. Conf. Ser. Mater. Sci. Eng., 701, 012050 (2019).
  • G. O. Cook and C. D. Sorensen, "Overview of transient liquid phase and partial transient liquid phase bonding", J. Mater. Sci., 46, 5305-5323 (2011).
  • Q. Guo, S. Sun, Z. Zhang, H. Chen and M. Li, "Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test", Microelectron. Reliab., 80, 144-148 (2018).
  • O. Mokhtari and H. Nishikawa, "Transient liquid phase bonding of Sn-Bi solder with added Cu particles", J. Mater. Sci: Mater Electron., 27, 4232-4244 (2016).
  • A. A. Bajwa and J. Wilde, "Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices", Microelectron. Reliab., 60, 116-125 (2016).
  • S. F. Corbin and D. J. McIsaac, "Differential scanning calorimetry of the stages of transient liquid phase sintering", Mat. Sci. Eng: A., 346(1-2), 132-140 (2003).
  • X. Qiao and S. F. Corbin, "Development of transient liquid phase sintered (TLPS) Sn-Bi solider pastes", Mat. Sci. Eng: A., 283(1-2), 38-45 (2000).
  • S. Cheng, C. M. Huang and M. Pecht, "A review of lead-free solders for electronics applications", Microelectron. Reliab., 75, 77-95 (2017).
  • X. Liu, M. Huang, N. Zhao, and L. Wang, "Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu substrate", J. Mater. Sci., 25, 328-337 (2014).
  • Y. W. Wang, Y. W. Lin, C. T. Tu, and C. R. Kao, "Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu", J. Alloys. Compd., 478(1-2), 121-127 (2009).
  • M. Hutter, R. Schmidt, P. Zerrer, S. Rauschenbach, K. Wittke, W. Scheel, and H. Reichl, "Effects of Additional Elements (Fe, Co, Al) on SnAgCu Solder Joints", Electron. Compon. Technol. Conf., 54-60 (2009).
  • Y. C. Sohn, J. Yu, S. K. Kang, D. Y. Shih, and T. Y. Lee, "Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization", J. Mater. Res., 19(8), 2428-2436 (2004).
  • Y. C. Sohn and J. Yu, "Correlation between Chemical Reaction and Brittle Fracture Found in ENIG (electroless Ni(P)/immersion gold)/solder Interconnection", J. Mater. Res., 20(8), 1931-1934 (2005).