Vol.30 No.4

Editorial Office


  • Journal of the Microelectronics and Packaging Society
  • Volume 30(4); 2023
  • Article


Journal of the Microelectronics and Packaging Society 2023;30(4):86-90. Published online: Feb, 20, 2024

A Study on the Control of Hygroscopicity and Hardness in Polymer Surfaces

  • Jinil Kim1 , Young Nam Jung2 , Doa Kim3 , and Myung Yung Jeong1,2†
    1Department of Cogno-Mechatronics Engineering, Pusan National University, Geumjeong-gu, Busan 46241, Korea, 2Department of Opto-Mechatronics Engineering, Pusan National University, Busan 46241, Korea, 3Materials and Components Research Division, Electronics and Telecommunications Research Institute (ETRI), 218 Gajeongno, Yuseong-gu, Daejeon, 34129 Republic of Korea
Corresponding author E-mail: myjeong@pusan.ac.kr

The packaging of electronic devices performs a protective function to ensure that their durability and reliability are not affected by changes in the operating environment caused by external factors. Recent advances in materials have led to ongoing research into bonded packaging of heterogeneous materials such as polymers and inorganic materials in electronic devices. In this packaging process, it is important to have a binding that joins the materials and ensures the operating environment, which includes adhesion to the substrate, corrosion and oxidation resistance through moisture removal, and durability. In this study, the hygroscopicity of the coating layer by modifying the polymer surface based on PVA was evaluated by controlling and measuring the contact angle, and the adhesion was confirmed by applying water-based ink and testing according to ASTM_D3363. For the durability of the polymer surface, the IPL post-treatment process was used to improve the hardness and toughness against applied voltage, and the pencil hardness test and nanoindentation test were conducted. Through this, we analyzed and proposed solutions to ensure the reliability and durability of polymer devices in polymer microfabrication against environmental factors such as moisture, temperature fluctuations and adhesion, and surface abrasion.

Keywords Packaging, Hygroscopicity, Adhesion, IPL, Gradient Hardness

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