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  • Journal of the Microelectronics and Packaging Society
  • Volume 25(1); 2018
  • Article

Review

Journal of the Microelectronics and Packaging Society 2018;25(1):17-22. Published online: May, 16, 2018

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DOI : 10.6117/kmeps.2018.25.1.017

Study on Effects of Solder Joint aging on the Reliability of Embedded Package Solder Joints using Numerical analysis

  • Seunghyun Cho1, Junyoung Jang2, 3, Youngbae Ko3, †
    1Department of Mechanical Engineering, Dongyang Mirae University, 445, Gyeongin-ro, Guro-gu, Seoul 08221, Korea 2Department of Mechanical Engineering, Inha University, 100 Inha-ro, Nam-gu Incheon 22212, Korea 3Molds & Dies Technology R&D Group, KITECH, 156, Gaetbeol-ro, Yeonsu-gu, Incheon 21999, Korea
Corresponding author E-mail: Kaiser74@kitech.re.kr
Abstract

본 논문에서는 임베딩 패키지의 솔더 조인트 신뢰성에 미치는 솔더 조인트의 에이징 효과를 유한요소법에 의한 수치해석을 통해 연구하였다. SAC305 솔더 조인트의 에이징 시간은 0, 60, 180 일이 적용되었고 신뢰성 분석을 위해 패키지 휨, ECS(Equivalent Creep Strain) 및 TSED(Total Strain Energy Density)이 분석되었다. 연구결과에 따르면 임베딩 패키지의 휨이 비임베딩 패키지에 비해 감소하여 임베딩 패키지내 솔더 접합부의 신뢰성이 높을 것으로 예측되었다. 또한, 에이징 시간이 길수록 임베디드 패키지의 휨이 감소하지만 솔더 조인트의 신뢰성 수명도 감소할 것으로 분석되었다.
In this paper, the effects of solder joint aging on the reliability of embedded package solder joints were investigated using numerical analysis by finite element method. Solder joints were SAC305 with aging time 0, 60, 180 days. For reliability analysis, warpage of package and equivalent creep strain (ECS) and total strain energy density (TSED) of solder joint were analyzed. The analysis results show that the package warpage is decreased in the case of the embedded package compared to the non embedded package, and the reliability life of the solder joint is predicted to be high. Also, it was interpreted that the longer the aging time, the less the warpage of the embedded package, but the reliability life of the solder joint would be shortened.

Keywords Embedded package, SAC305, ANAND model, Warpage, TSED, FEM.