2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(1); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(1):35-42. Published online: May, 10, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.1.035

Properties of Cu Pillar Bump Joints during Isothermal Aging

  • Eun-Su Jang1 , Eun-Chae Noh1 , So-Jeong Na2 , and Jeong-Won Yoon1,†
    1Department of Advanced Materials Engineering, Chungbuk National University, Chungdae-ro, Seowon-gu, Cheongju, Chungbuk 28644, Korea, 2Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-Gu, Incheon 21999, Korea
Corresponding author E-mail: jwyoon@chungbuk.ac.kr
Abstract

Recently, with the miniaturization and high integration of semiconductor chips, the bump bridge phenomenon caused by fine pitches is drawing attention as a problem. Accordingly, Cu pillar bump, which can minimize the bump bridge phenomenon, is widely applied in the semiconductor package industry for fine pitch applications. When exposed to a high-temperature environment, the thickness of the intermetallic compound (IMC) formed at the joint interface increases, and at the same time, Kirkendall void is formed and grown inside some IMC/Cu and IMC interfaces. Therefore, it is important to control the excessive growth of IMC and the formation and growth of Kirkendall voids because they weaken the mechanical reliability of the joints. Therefore, in this study, isothermal aging evaluation of Cu pillar bump joints with a CS (Cu+ Sn-1.8Ag Solder) structure was performed and the corresponding results was reported.

Keywords Cu pillar bump, Intermetallic compound, Kirkendall void, Aging, Reflow soldering

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