2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(3); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(3):10-17. Published online: Oct, 29, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.3.010

Advancements in Bonding Technologies for Flexible Display Driver IC(DDI) Packaging

  • Kyeong Tae Kim1,2 and Yei Hwan Jung1,†
    1 Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea, 2 STECO, Cheonan, Republic of Korea
Corresponding author E-mail: yjung@hanyang.ac.kr
Abstract

This paper discusses Chip On Film (COF) technology, one of the key technologies in flexible packaging to enable miniaturization and flexibility of electronic devices. COF attaches Display Driver IC (DDI) directly to a flexible polyimide substrate, enabling lightweight and reduced thickness for high-resolution displays. COF technology is primarily used in high-performance display panels, such as organic light emitting diode (OLED) displays, and plays a key role in portable electronic devices, such as smartphones and wearable devices. This study analyzes the key components of COF and advances in bonding technology. In particular, the introduction of modern bonding techniques, such as thermocompression bonding and thermo-sonic bonding, has led to significant improvements in bonding reliability and electrical performance. These bonding techniques enhance the mechanical stability of COF packages while maintaining high electrical connectivity in fine-pitch structures. This paper will discuss the future development of COF bonding technology and its challenges and explore its potential as a next-generation display and advanced packaging technology.

Keywords Chip On Film, Flexible Package, Thermo-compression bonding, Anisotropic conductive, Non-conductive

REFERENCES
  • C.-I. Chen, C.-Y. Ni, C.-M. Chang, S.-C. Wu, D.-S. Liu, Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder, IEEE Transactions on Electronics Packaging Manufacturing, 31 (2008)
  • K.-M. Harr, S.-C. Kim, Y.-M. Kim, Y.-H. Kim, Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive, Microelectronics Reliability, 55 (2015)
  • S.-C. Kim, Y.-H. Kim, Low temperature chip on film bonding technology for 20 μm pitch applications, Journal of Materials Science: Materials in Electronics, 27 (2015)
  • D.-S. Liu, S.-S. Yeh, C.-T. Kao, H.-C. Shen, G.-S. Shen, H.-H. Liu, Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process, IEEE Transactions on Advanced Packaging, 32 (2009)
  • A. Roshanghias, A. D. Rodrigues, D. Holzmann, Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates, Microelectronic Engineering, 228 (2020)
  • B.-R. Lee, J.-M. Park, Y.-K. Ko, C.-W. Lee, Y.-B. Park, Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu/Sn-3.5Ag Microbump, Journal of the Microelectronics and Packaging Society, 20 (2013)
  • J. H. Lau, Recent Advances and Trends in Advanced Packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 12 (2022)
  • M. J. Yim, K. W. Paik, Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications, International Journal of Adhesion and Adhesives, 26 (2006)
  • C.-K. Chung, K.-W. Paik, A Study on the Assembly Process and Reliability of COF (Chip-On-Flex)Using ACFs (Anisotropic Conductive Films) for CCM (Compact Camera Module), J. Microelectron. Packag. Soc., 15 (2008)
  • S.-Y. Jung, K.-W. Paik, , A Study on the Flexible Chip-on-Fabric (COF) Assembly using Anisotropic Conductive Films (ACFs) Materials, (2019)
  • J.-H. Kim, T.-I. Lee, J.-W. Shin, T.-S. Kim, K.-W. Paik, Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications, IEEE Transactions on Components, Packaging and Manufacturing Technology, 6 (2016)
  • S. Zhang, M. Yang, Y. Wu, J. Du, T. Lin, P. He, M. Huang, K.-W. Paik, A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature, IEEE Transactions on Components, Packaging and Manufacturing Technology, 8 (2018)
  • J.-W. Kim, D.-G. Kim, Y.-C. Lee, S.-B. Jung, Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections, IEEE Transactions on Components and Packaging Technologies, 31 (2008)
  • S. Lee, J. Park, J.-H. Park, H. Lee, S. Shin, Y. Kim, W. Kim, T. Choi, K.-W. Paik, The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-μm Fine Pitch Cu-Pillar/Ni/SnAg Microbump Flip-Chip Assembly, IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (2019)
  • Y. Cheung, D. Tian, G. Y. Mak, M. Li, , Solder Joint Integrity of TC-NCP Thermo-compression Bonding Process, (2012)
  • H.-Y. Kim, K.-E. Min, J.-S. Lee, S.-J. Lee, S.-S. Lee, J.-K. Kim, Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste, Electronic Materials Letters, 12 (2016)
  • T. Nonaka, S. Niizeki, N. Asahi, K. Fujimaru, , Low temperature touch down and suppressing filler trapping bonding process with a wafer level pre-applied underfilling film adhesive, (2012)
  • S. Tan, Y. Chan, N. S. Lui, Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications, Journal of electronic materials, 34 (2005)
  • J. S. Lee, S. J. Kang, J. H. Shin, Y. J. Shin, B. Lee, J. M. Koo, T. I. Kim, Nanoscale-Dewetting-Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing, Adv Mater, 32 (2020)
  • Y. C. Lin, J. Zhong, A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications, Journal of Materials Science, 43 (2008)
  • S.-T. Lu, Y.-M. Lin, C.-C. Chuang, T.-H. Chen, W.-H. Chen, , A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch, (2009)
  • S.-C. Kim, Y.-H. Kim, Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA), Current Applied Physics, 13 (2013)
  • Y. C. Chan, S. C. Tan, N. S. M. Lui, C. W. Tan, Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages, IEEE Transactions on Advanced Packagin, 30 (2007)
  • J.-Y. Ryu, S.-H. Noh, , Automatic Defect Detection System for Ultra Fine Pattern Chip-on-Film, (2010)
  • C.-T. Hsieh, K.-H. Liao, G.-J. Chen, C.-M. Lee, H.-J. Lin, K.-J. Cheng, Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex, IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 (2011)
  • J.-Y. Juang, S.-T. Lu, S.-C. Chung, S.-M. Cheng, J.-S. Peng, Y.-L. Lu, P.-C. Chang, C.-W. Fan, C.-J. Zhan, T.-H. Chen, , The development of high through-put micro-bump-bonded process with non-conductive paste (NCP), (2012)
  • K.-L. Suk, K. Choo, S. J. Kim, J.-S. Kim, K.-W. Paik, Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs), Microelectronics Reliability, 52 (2012)
  • K. E. Aasmundtveit, T. A. Tollefsen, T.-T. Luu, A. Duan, K. Wang, N. Hoivik, , Solid-Liquid Interdiffusion (SLID) bonding—Intermetallic bonding for high temperature applications, (2013)
  • J.-W. Yoon, J.-W. Kim, J.-M. Koo, S.-S. Ha, B.-I. Noh, W.-C. Moon, J.-H. Moon, S.-B. Jung, Flip-chip Bonding Technology and Reliability of Electronic Packaging, Journal of Welding and Joining, 25 (2007)