2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(3); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(3):42-49. Published online: Oct, 30, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.3.042

Development and Evaluation of Trimodal Silver Paste for High-Frequency EMI Shielding Films with a Focus on Flexibility, Durability, and Shielding Characteristics

  • Hyun Jin Nam1 , Seonwoo Kim1 , Yubin Kim1 , Se-Hoon Park1 , Moses Gu2 , and Su-Yong Nam3,†
    1 ICT device Packaging Research Center, Korea Electronics Technology Institute (KETI), 25, Saenari-ro, Bundang-gu, Seongnam-si, Gyeonggi-do 13509, Republic of Korea, 2 Department of Semiconductor Engineering, Seoul National University of Science and Technology, Gongneung-ro 232, Nowon-gu, Seoul 01811, Republic of Korea, 3 Department of Nanotechnology Engineering, Pukyong National University, Busan 48513, Republic of Korea
Corresponding author E-mail: suynam@pknu.ac.kr
Abstract

In the electromagnetic wave shielding material market, superior shielding performance in the high-frequency range, along with flexibility and durability, has emerged as critical requirements. The need for high-performance EMI (Electromagnetic Interference) films to address electromagnetic wave interference issues is growing, particularly in various industrial sectors such as smart electronic devices, automotive electronic systems, and communication equipment. In this study, a trimodal silver paste was developed and fabricated into an EMI film, with its performance evaluated. The developed silver paste, utilizing a modified epoxy binder, exhibited properties suitable for screen printing processes. The film demonstrated excellent shielding performance, with an average attenuation of -99 dB in the high-frequency range of the 5G spectrum (26.5 GHz to 40 GHz), and a shielding effectiveness of -90.3 dB at 33.6 GHz. Flexibility and durability tests showed that the film maintained its flexibility even at a curvature radius of 1 mm. In the bending cycle test, the resistance increased by approximately 25.5% from 0.51 Ω to 0.64 Ω after 10,000 cycles in the outer bending scenario, while in the inner bending scenario, the resistance decreased by about 3.6%, indicating reduced resistance to compressive stress.

Keywords Electromagnetic interference shielding, Trimodal silver paste, Flexible shielding film, High frequency

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