2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(3); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(3):62-66. Published online: Oct, 30, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.3.062

A Shape Inspection of Multiple Micro Solder Balls without Positioning Control

  • Jee Hong Kim†
    Department of Electric Engineering, Pukyong National University, 45 Yongso-Ro, Busan 48513, Korea
Corresponding author E-mail: jeehongk@pknu.ac.kr
Abstract

A statistical approach to inspection of the 3-D shape of micro solder balls is proposed, where an optical method with spatially arranged LED and specular reflection is used. The reflected image captured by a vision system was analyzed to calculate the relative displacements of LED’s in the image. Also, the statistics of displacements for the micro solder balls contained in a captured image are used to detect existing defects, and the usefulness of the proposed method is shown via experiments.

Keywords Micro solder ball, 3-D shape inspection, Machine vision

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