2024

Vol.31 No.3

Current Issue Archives
Search
Advanced Search
Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 31(3); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(3):80-86. Published online: Oct, 30, 2024

PDF Full Text XML

DOI : doi.org/10.6117/kmeps.2024.31.3.080

A Study about Decrease of Oxygen Permeability with Adding Glass Flakes and (3-Aminopropyl)triethoxysilane on Polyimide Films

  • Ha-Yoon Nah1 , Taehee Kim1 , Haryeong Choi1 , Ji-Seoung Kim1 , Won-Jun Lee1 , Eunkyung Jeon2 , Joon Hyuk Lee2 , and Hyung-Ho Park1,3†
    1 Department of Materials Science and Engineering, Yonsei University, 50, Yonsei-ro, Seodaemun-gu, Seoul, South Korea, 03722, 2 Agency for Defense Development, Yuseong P.O. Box 35, Daejeon, South Korea, 34186, 3 Aerogel Materials Research Center, 50, Yonsei-ro, Seodaemun-gu, Seoul, South Korea, 03722
Corresponding author E-mail: hhpark@yonsei.ac.kr
Abstract

Polyimide has advantages that are different with other polymers, such as high thermal stability, heat resistance, and high chemical resistance. Various application methods for Polyimide have been studied. In this study, research was conducted to manufacture Polyimide films. While implementing Polyimide films with excellent adhesion and pencil hardness through optimized manufacturing conditions, the applicability as a packaging material was considered by adding glass flakes to reduce oxygen permeability. As a result, Polyimide films with glass flakes and (3-Aminopropyl)triethoxysilane have a thickness of about 50 μm were uniformly implemented, and it was confirmed that the adhesion of Polyimide films was 4B, pencil hardness was 5H, and oxygen permeability was below 8.795 × 10-9 cc/s, respectively.

Keywords Polyimide, Glass flake, (3-Aminopropyl)triethoxysilane, Oxygen permeability, Pencil hardness, Adhesion

REFERENCES
  • S.-Y. Yan, L.-L. Yuan, , Advanced Polyimide Materials, (2018)
  • Z. Wu, J. He, H. Yang, S. Yang, Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties, Polymers, 14 (2022)
  • K. Ruan, Y. Guo, J. Gu, Liquid Crystalline Polyimide Films with High Intrinsic Thermal Conductivities and Robust Toughness, Macromolecules, 54 (2021)
  • W. Chen, W. Chen, B. Zhang, S. Yang, C.-Y. Liu, Thermal imidization process of polyimide film: Interplay between solvent evaporation and imidization, Polymer, 109 (2017)
  • G. M. Bower, L. W. Frost, Aromatic polyimides, Journal of Polymer Science Part A, 1 (1963)
  • C. E. Sroog, A. L. Endrey, S. V. Abramo, C. E. Berr, W. M. Edwards, K. L. Olivier, Aromatic polypyromellitimides from aromatic polyamic acids, Journal of Polymer Science Part A, 3 (1965)
  • C. Feger, Curing of polyimides, Polymer Engineering Science, 29 (1989)
  • J. R. Ojeda, J. Mobley, D. C. Martin, Physical and chemical evolution of PMDA-ODA during thermal imidization, Journal of Polymer Science Part B, 33 (1995)
  • M.-H. Tsai, I.-H. Tseng, Y.-C. Huang, H.-P. Yu, P.-Y. Chang, Transparent Polyimide Film with Improved Water and Oxygen Barrier Property by In-Situ Exfoliating Graphite, Advanced Engineering Materials, 18 (2016)
  • H. W. Liu, K. F. Xie, Z. B. Yang, H. M. Dai, The Advantages of Basalt Glass Flake Coating for Marine Anticorrosion, Advanced Materials Research, 332-334 (2011)
  • Y.-H. Kim, H.-S. Kim, S.-K. Kwon, Synthesis and Characterization of Highly Soluble and Oxygen Permeable New Polyimides Based on Twisted Biphenyl Dianhydride and Spirobifluorene Diamine, Macromolecules, 38 (2005)
  • Q.-P. Liu, L.-X. Gao, Z.-W. Gao, L. Yang, Preparation and characterization of polyimide/silica nanocomposite spheres, Materials Letters, 61 (2007)
  • N. Jain, S. K. Tripathi, M. Nasim, Preparation and Characterization of Aminopropylsilatrane Endcapped Polyimide Films, International Journal of Polymeric Materials and Polymeric Biomaterials, 63 (2014)
  • H. Xu, X. Cao, Y. Shi, T. Cong, H. Liu, Y. Gao, In situ formation of POSS layer on the surface of polyimide film and anti-atomic oxygen of SiO2/POSS coatings, Progress in Organic Coatings, 182 (2023)
  • H. Wang, W. Zhong, P. Xu, Q. Du, Properties of Polyimide/Silica Nanohybrids from Silicic Acid Oligomer, Macromolecular Materials and Engineering, 289 (2004)
  • G. Wang, J. Yang, Influences of glass flakes on fire protection and water resistance of waterborne intumescent fireresistive coating for steel structure, Progress in Organic Coatings, 70 (2011)
  • N. D. Ghatge, N. N. Maldar, Polyimides from dianhydride and diamine: structure property relations by thermogravimetric analysis (t.g.a.), Polymer, 25 (1984)
  • L. Li, C. Guan, A. Zhang, D. Chen, Z. Qing, Thermal stabilities and the thermal degradation kinetics of polyimides, Polymer Degradation and Stability, 84 (2004)
  • Z Wu, J. He, H. Yang, S. Yang, Progress in Aromatic Polyimide Films for Electronic Applications: Preparation, Structure and Properties, Polymers, 14 (2022)
  • T. Agag, T. Kakeichi, Synthesis and characterization of epoxy film cured with reactive polyimide, Polymer, 40 (1999)
  • H. M. S. Mehr, T. J. Hammer, M. D. Soucek, Polyimide–polyester hybrid UV-curable powder coating, Journal of Coatings Technology and Research, 18 (2021)
  • H. Kim, Y.-R. Kim, J. Lee, H. Lee, Y. Jeon, S. Park, Y.-S. Kim, H.-M. Seong, G. Kwak, Highly tough, colorless, transparent polyamide-imide films from one reaction vessel without purification, Macromolecular Research, 31 (2023)
  • X. Wu, J. Liu, G. Jiang, Y. Zhang, C. Guo, Y. Zhang, L. Qi, X. Zhang, Highly transparent preimidized semi-alicyclic polyimide varnishes with low curing temperatures and desirable processing viscosities at high solid contents: preparation and applications for LED chip passivation, Journal of Materials Science: Materials in Electronics, 30 (2019)
  • S. Mazinani, S. Darvishmanesh, R. Ramazani, B. V. ruggen, Miscibility of polyimide blends: Physicochemical characterization of two high performance polyimide polymers, Reactive and Functional Polymers, 111 (2017)
  • D. Mao, G. Lv, G. Gao, B. Fan, Fabrication of polyimide films with imaging quality using a spin-coating method for potential optical applications, Journal of Polymer Engineering, 39 (2019)
  • H. J. Kim, Y. J. Park, J.-H. Choi, H. S. Han, Y. T. Hong, Surface modification of polyimide film by coupling reaction for copper metallization, Journal of Industrial and Engineering Chemistry, 15 (2009)
  • Y. Liao, B. Cao, W.-C. Wang, L. Zhang, D. Wu, R. Jin, A facile method for preparing highly conductive and reflective surface-silvered polyimide films, Applied Surface Science, 255 (2009)
  • Z. Wu, D. Wu, W. Yang, R. Jin, Preparation of highly reflective and conductive metallized polyimide films through surface modification: processing, morphology and properties, Royal Society of Chemistry, 16 (2006)
  • L. J. Rooyen, J. Karger-Kocsis, O. C. Vorster, L. D. Kock, Helium gas permeability reduction of epoxy composite coatings by incorporation of glass flakes, Journal of Membrane Science, 430 (2013)
  • G. Yan, M. Wang, T. Sun, X. Li, G. Wang, W. Yin, Anti-Corrosion Property of Glass Flake Reinforced Chemically Bonded Phosphate Ceramic Coatings, Materials, 12 (2019)
  • I. A. Channa, J. Ashfaq, S. J. Gilani, A. D. Chandio, S. Yusuf, M. A. Makhdoom, M. N. Jumah, Sustainable and Eco-Friendly Packaging Films Based on Poly (Vinyl Alcohol) and Glass Flakes, Membranes, 12 (2022)
  • L. Zhai, G. Li, Y. Xu, M. Xiao, S. Wang, Y. Meng, Poly (propylene carbonate)/aluminum flake composite films with enhanced gas barrier properties, Applied Polymer, 132 (2015)
  • Z. Shao, P. Ren, T. Jia, B. Lei, Z. Feng, H. Gu, S. Chen, P. Zhang, G. Meng, High-pressure induced acceleration pathways for water diffusion in heavy duty anticorrosion coatings under deep ocean environment: (I) The samples subjected to high-pressure pre-processing, Progress in Organic Coatings, 170 (2022)
  • W. Tian, L. Liu, F. Meng, Y. Liu, Y. Li, F. Wang, The failure behaviour of an epoxy glass flake coating/steel system under marine alternating hydrostatic pressure, Corrosion Science, 85 (2014)
  • T. Tian, J.-X. Zhong, M. Yang, W. Feng, C. Zhang, W. Zhang, Y. Abdi, L. Wang, B.-X. Lei, W.-Q. Wu, Interfacial Linkage and Carbon Encapsulation Enable Full Solution‐Printed Perovskite Photovoltaics with Prolonged Lifespan, Angewandte Chemie International Edition, 60 (2021)
  • Z. Chen, J. Zhao, C. Jin, Y. Yuan, Y. Zhang, M. Tatoulian, X. Rao, Plasma deposited APTES: A potential film for biomedical application, Materials Letters, 264 (2020)