2024

Vol.31 No.3

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(3); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(3):91-98. Published online: Oct, 30, 2024

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DOI : doi.org/10.6117/kmeps.2024.31.3.091

Driving Forces of Silver Nano-porous Sheet Die Bonding at 145 °C and 175 °C in the Air

  • YehRi Kim1,2, Eunjin Jo1,3, and Dongjin Kim1,†
    1 Advanced Packaging Integration Center , Korea Institute of Industrial Technology (KITECH), Incheon, Republic of Korea, 2 School of Electrical Engineering, Graduate School, Korea University, Seoul, Republic of Korea, 3 School of Materials Science and Engineering, Andong National University, Andong, Republic of Korea
Corresponding author E-mail: dongjinkim@kitech.re.kr
Abstract

This study reveals the feasibility and effectiveness of sinter bonding using an Ag nano-porous sheet at the lowest “theoretically” possible temperature of 145 °C. By uniform pressure of 10 MPa for bonding times of 5 min and 10 min at 145 and 175 °C, we achieved bonding strengths exceeding approximately 20 MPa with a only 5 min of bonding time at 145 °C. In particular, it is interesting to note that in the pressure sintering bonding process at 145 °C, bonding times of 5 and 10 min had no significant difference in strength. Even with a bonding temperature of 175 °C, the difference in average bonding strength between bonding times of 5 min (i.e., 37.6 MPa) and 10 min (i.e., 43.0 MPa) was only 5 MPa. The bonding strength was fundamentally attributed to the thickness of the Ag sintered neck in the Ag sintered layer. Microstructural analysis revealed that as the bonding temperature increased to 175 °C, the fraction of CSL Σ3 boundaries within the Ag sintered layer increased, indicating greater coalescence of Ag particles. This study systematically investigated the mechanism of bonding strength in extremely low-temperature pressure Ag sinter bonding, considering the relationship between microstructures and mechanical behaviors.

Keywords Ag nano-porous sheet, Sheet bonding, Power module, Pressure bonding process, Mechanical strength

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