Journal of the Microelectronics and Packaging Society

Semiconductor packaging and testing are critical for ensuring the quality and performance of devices, especially as they become more miniaturized and integrated. The increasing demand for MEMS (Micro Electro Mechanical System)-based test socket technology has led to the widespread use of micro pins, designed for 300 μm pitch applications with diameters around 230 μm, in electrical testing. Due to their small size, traditional manual vision inspection methods face limitations in accuracy and efficiency. To address this, we designed an automated vision inspection system using the YOLO (You Only Look Once) algorithm to detect defects in micro pins. By capturing images of the spring part and measuring parameters such as length and width, we achieved a detection accuracy of 95%. This automated system significantly enhances accuracy and efficiency compared to manual methods, suggesting its potential application in semiconductor test equipment.

Keywords Semiconductor socket, Micro pin, Vision inspection, Defect detection, YOLO algorithm