2025

Vol.31 No.4

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(4); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(4):76-82. Published online: Jan, 22, 2025

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DOI : doi.org/10.6117/kmeps.2024.31.4.076

Comparison of Through Glass Via Machining Geometry and Mechanical Properties Using Single Mode and Burst Mode of Femtosecond Laser

  • LeeJaebeom1,2, ParkJiyong1,3,†
    1Advanced Packaging Integration Center (APIC), Korea Institute of Industrial Technology (KITECH), Incheon, Republic of Korea 2Department of Mechanical Engineering, Hanyang University, Seoul, Republic of Korea 3Department of Convergence Manufacturing System Engineering, Korea National University of Science and Technology (UST), Daejeon, Republic of Korea
Corresponding author E-mail: j.park@kitech.re.kr
Abstract

Recently, there has been a lot of research into glass as a material for interposer substrates used in 2.5D packaging technologies. Femtosecond lasers have been widely used to form TGV (through glass via) structures on glass interposers. However, damage caused by thermoelastic waves and shock waves during the TGV fabrication process using femtosecond lasers can limit the formation of vias with fine pitch, making it crucial to minimize damage during processing the damage caused by thermoelastic and shock waves during the processing of TGVs with femtosecond lasers is a challenge in forming closely spaced vias. In this study, we propose to reduce the via spacing while suppressing the damage caused by the single mode to the around of the via by using the burst mode in which the single pulse of the femtosecond laser is distributed and oscillated, and to analyze the mechanical properties around the via processed by single mode and burst mode through nanoindenter to suggest that the reason for the damage is related to the elastic modulus.

Keywords Femtosecond laser, Through glass via, Burst mode, Fine pitch

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