2025

Vol.31 No.4

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  • Journal of the Microelectronics and Packaging Society
  • Volume 31(4); 2024
  • Article

Review

Journal of the Microelectronics and Packaging Society 2024;31(4):89-95. Published online: Jan, 22, 2025

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DOI : https://doi.org/10.6117/kmeps.2024.31.4.089

Effect on Temperature Uniformity by Factor for the Design of Heater Pattern of Electrostatic Chuck

  • KimSang-Hoon1,*, ParkSang-Hyeon1,*, ShinHee-Jun1, ParkJeong-Woo1, YoonJungwoo1, SeoKyoung-Jun1, ImDong Hyeok2, LeeYong-Seok1,†
    1Department of Mechanical Engineering, Myongji University, 116, Myongji-ro, Yongin-si, Gyeonggi-do, 17058, Korea 2DT ENG Inc, 6, Dongtansandan-gil, Hwaseong-si, Gyeonggi-do, 18487, Korea
Corresponding author E-mail: yslee23@mju.ac.kr
Abstract

The use and research of electrostatic chuck, a semiconductor equipment, are actively conducted to equalize the temperature applied to the wafer in the semiconductor manufacturing process. In this study, we propose a model that optimize the surface temperature uniformity through the design of a heater pattern among the parts of the electrostatic chuck. Electrostatic chuck consist of the two zone heater pattern, bonding layer, dielectric layer, plate and cooling path. The process environment assumed RIE and the heater pattern was heated by the applied voltage. According to the finite element method, we analyzed the effect that influence to temperature uniformity about model changed line width and Pigtail of heater pattern, and figured out the change of current density by shape of pattern. Finally, the proposed design model is expected to significantly improve the temperature uniformity of the electrostatic chuck surface and contribute to increasing the consistency of the semiconductor process. This study is expected important basic data for design optimization of ESC.

Keywords Electrostatic chuck, Heater pattern, Semiconductor process, Temperature uniformity, Finite element method

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