2024

Vol.31 No.3

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 26(2); 2019
  • Article

Review

Journal of the Microelectronics and Packaging Society 2019;26(2):23-29. Published online: Sep, 20, 2019

Chemically Bonded Thermally Expandable Microsphere-silica Composite Aerogel with Thermal Insulation Property for Industrial Use

  • Kyu-Yeon Lee1, Varsha D. Phadtare1, Haryeong Choi1, Seung Hwan Moon2, Jong Il Kim2, Young Kwang Bae2, Hyung-Ho Park1,†
    1Department of Materials Science and Engineering, Yonsei University 2Enterprise Research Institute, Eslin Corporation
Corresponding author E-mail: hhpark@yonsei.ac.kr
Abstract

Thermally expandable microsphere and aerogel composite was prepared by chemical compositization. Microsphere can produce synergies with aerogel, especially an enhancement of mechanical property. Through condensation between sulfonated microsphere and hydrolyzed silica sol, chemically-connected composite aerogel could be prepared. The presence of hydroxyl group on the sulfonated microsphere was observed, which was the prime functional group of reaction with hydrolyzed silica sol. Silica aerogel-coated microsphere was confirmed through microstructure analysis. The presence of silicon-carbon absorption band and peaks from composite aerogel was observed, which proved the chemical bonding between them. A relatively low thermal conductivity value of 0.063 W/m·K was obtained.

Keywords Thermally expandable microsphere, aerogel, organic-inorganic, composites, insulator