2024

Vol.31 No.2

Editorial Office

Review

  • Journal of the Microelectronics and Packaging Society
  • Volume 26(4); 2019
  • Article

Review

Journal of the Microelectronics and Packaging Society 2019;26(4):157-161. Published online: Mar, 23, 2020

Point Defect Engineering Approaches to Enhance the Performance of Thermoelectric Materials

  • Hyun-Sik Kim1, Hyung Mo Jeong2, Soon-Mok Choi3,†, and Kyu Hyoung Lee4,‡
    1Department of Materials Science and Engineering, Hongik University, 2Department of Materials Science and Engineering, Kangwon National University, 3School of Energy, Materials and Chemical Engineering, Korea University of
Corresponding author E-mail: smchoi@koreatech.ac.kr, khlee2018@yonsei.ac.kr
Abstract

소재의 전기전도 거동과 열전도 거동을 독립적으로 제어하는 기술은 열전소재의 성능증대를 위한 효과적인 전 략 중 하나로 인식되고 있다. 이를 구현하기 위해 다결정 소재가 근본적으로 포함하고 있는 결함구조와 열전소재의 물성 과의 상관관계에 대한 수많은 연구가 진행되고 있으며, 최근 0 차원의 점결함 형성에 의해 전기전도 특성을 증대함과 동 시에 열전도 특성을 저감하는 결과가 보고되고 있다. 본 논문에서는 점결함 형성에 의한 소재의 전기전도 거동 및 열전 도 거동 변화에 대해 이론적 고찰을 진행하고, 벌크 열전소재에서 실험적으로 구현된 결과와 연계하여 고성능 열전소재 개발에 필수적인 소재설계 지침에 대한 실효적인 정보를 제공하고자 한다.
Independent control of electronic and thermal transport behaviors is one of the most effective approaches to enhance the performance of thermoelectric materials. To address this, many researches on the relationship between defect structures and thermoelectric properties have been carried out since defects are intrinsic ingredients of polycrystalline materials. Recently, experimental results of simultaneously improved electronic and thermal transport properties have been reported via the formation of 0-dimensional point defects. Here, theoretical backgrounds to the engineering of electronic and thermal transport behaviors by the formation of point defects are discussed and related experimental considerations are also presented in order to provide a practical guide for the development of highperformance thermoelectric materials.

Keywords Thermoelectric, Electronic transport, Thermal transport, Defect structures, Point defect